Machine for in-line and off-line http://www.selen.hr/pokaz_kategorie.php?cid=437
Inspection and Data Creation Tool for the Stencil / Screen Fabrication Industry. World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, elimina
Electronics Forum | Tue Jun 05 16:40:46 EDT 2001 | kerryn
Thanks Phil. However, my objective is to identify stencils that are not 100% clean prior to sending to inventory. I want to catch it before the solder paste has a chance to dry and harden in the apertures. Kerry
Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Used SMT Equipment | Assembly Accessories
Description Lot# - 13360-97 Condition - Used/See Description Package Lot including all Lots except for Feeders, Changeover Tables and Docking Stations.This Lots contains below assets:ASM / Siemens Siplace 'SX-2' Placement Machine (2020)ASM
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics LSM models for sale. Fully Reconditioned machine with warranty. 100% complete. Consider trade in for similar machines working or non-working. Also offer repair services for all CyberOptics machines.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Parts & Supplies | Screen Printers
High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue ZK Electronic Technology Co.,Limited becky@hysmt.cn www.smt-cn.com skype:beckysmt wechat:15323874439
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,
Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
Events Calendar | Mon Aug 10 00:00:00 EDT 2020 - Mon Aug 10 00:00:00 EDT 2020 | ,
Monitoring & Bench marking Your Processes and Assembly Yields
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
SMTnet Express, February 13, 2020, Subscribers: 34,017, Companies: 10,974, Users: 25,597 Size Matters - The Effects of Solder Powder Size on Solder Paste Performance Credits: FCT ASSEMBLY, INC. Solder powder size is a popular topic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=16
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Test and Inspection Products Content Your results for: Test and Inspection Hot Bump Pull Nordson DAGE Nordson DAGE has developed a unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull
| https://www.smtfactory.com/SPI-Solder-Paste-Inspection-pl3558223.html
SPI / Solder Paste Inspection from China, SPI / Solder Paste Inspection Manufacturer & Supplier - I.C.T SMT Machine English Bahasa indonesia Сербия
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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