Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
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Industry Directory | Equipment Dealer / Broker / Auctions
Buyer, Seller, Broker of Electronic Assembly Equipment
New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Electronics Forum | Sat Feb 06 07:14:40 EST 2021 | agoesfirmanto
Dear Sirs, very sorry being late reply after a year. Thank you very much for your advices, you are absolutely correct after reduce grounding pad size. No more solder ball issue. Thank you very much. highly appreciate all of your supports. Best re
Electronics Forum | Thu Aug 24 14:42:30 EDT 2006 | any
y we had solder ball after reflow owen?
Used SMT Equipment | Chipshooters / Chip Mounters
KE3010 High-speed Placement Machine JUKI KE3010 High-speed Placement Machine Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machin
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
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Parts & Supplies | Pick and Place/Feeders
AF8X4 Mechanical Feeder Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machine] and so on. Our company I is one of the largest supp
Parts & Supplies | Pick and Place/Feeders
Electric Feeder 8MM Original new Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machine] and so on. Our company I is one of the lar
Technical Library | 2012-10-04 18:52:43.0
First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
SMT solder dross recovery system solder waste recycling separator online automatic solder dross separator HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce product
1.Characteristic: 1.Highly effective recycling of the solder waste, up to 93% yield . 2.No need to add any chemicals or reducers to the process uses physical separation to ensure a good quality product. 3.Button controls, digital temperature contr
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | Oakville, Ontario Canada | Production
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o
Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Springdale, Arkansas USA | Production,Research and Development
solder, electronic assembly, pcb repair, wave solder, smt, solder pot, testing unit,dexterity, program IC's,the rest in resume
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
