Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Standards Setting / Certification / Training Provider
PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Fri Jan 28 05:06:01 EST 2000 | Istv�n Dominik
Hi! I have problems with the SMD boards during wave soldering. Mainly between the pins of the SOICs there are small solder balls. Maybe somebody had the same problem and could solve it. Please give me some ideas what causes this problem and how it
Electronics Forum | Thu Apr 16 09:33:12 EDT 1998 | Philippe
Is there anybody to help me ? We have small balls appearing on the boards soldered by wave soldering machine and it looks that use of nitrogen is linked to the problem (because without nitrogen, we have no more problems). That remind you something ?
Industry News | 2016-12-27 13:55:03.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that Ankatek of Turkey has been awarded the 2016 Achievement award as the distributor who has really gone above and beyond. In Ankatek’s case, that means breaking into a previously dormant market.
Industry News | 2010-12-01 13:36:54.0
Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
ETA DIP Inverted Camera Online AOI Machine ETA-V5200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | Dasmarinas, Philippines | Sales/Marketing
an experienced sales and marketing professional with strong background in SMT production process
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
