Industry Directory | Manufacturer
Brazing and soldering, metal bonding, dissimilar materials, active solder technology
Utilise Gold contains an international business directory of suppliers of precious metal materials used in the electronics industry, including contacts, plating salts, pastes, solders, bonding wires and evaporation materials.
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond
I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether
Electronics Forum | Thu Apr 09 12:33:43 EDT 1998 | Earl Moon
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Used SMT Equipment | Soldering - Selective
Hot Bar Soldering Flex Circuit to PCB Ribbon Cable to PCB Coaxial Cables Fine Pitch SM Devices Edge Connectors to PCB Thermocompression Bonding Tab to PCB, HSC to LCD or tab More information pjbril@smtunion.com m.madera@smtunion.com W
Used SMT Equipment | Soldering - Selective
Thermode Length 100mm, Stroke 50mm, Flex Bond 1/2inch Force 10 to 100N @ Bar Preheat/Reflow 0-200 Seconds Work Area 260X200mm Temp Range 25 to 400c in 1 degree Intervals Voltage 110/220 CCD Camera System with Monitor Condi
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2016-08-24 06:15:35.0
From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Aug 21 00:00:00 EDT 2024 - Wed Aug 21 00:00:00 EDT 2024 | Kaohsiung City, Taiwan
Taiwan Alliance LTS Workshop
Career Center | Brookfield, Wisconsin USA | Engineering
SR. ENGINEER � SENSORS -- $60-$80K Company: Well established controls manufacturer that has seen steady growth over the past several years. This company has a history of anticipating and successfully capitalizing on new market needs. Being one of t
Career Center | New Delhi, New Delhi India | Sales/Marketing
Equipment related to PCB Assembly ( wave soldering , Selective soldering , reflow , pick'n'place system , PCB Inspection system , PCB Rework System ,Flip - Chip Bonding system , Component forming system ). ---> Equipment relat
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
Career Center | Cavite, Philippines | Maintenance,Production,Technical Support
January 15- 2013 to Prsent :Maintenace Technician National Agriculture Development Company Haradh Project 2557 Riyadh 11461, Saudi Arabia Responsibilities 1. Daily checking of Electrical Panels 2. Install Main power for
SMTnet Express, August 31, 2017, Subscribers: 30,770, Companies: 10,706, Users: 23,739 NSOP Reduction for QFN RFIC Packages Mumtaz Y. Bora; Peregrine Semiconductor Wire bonded packages using conventional copper leadframe have been used in industry
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages Optimizing Reflowed Solder TIM (sTIMs
| http://etasmt.com/cc?ID=te_news_bulletin,11161&url=_print
solder on both sides of the component melts and bonds to the main board. 1. Set a reasonable reflow soldering oven temperature curve and perform real-time testing of the temperature curve on a regular basis. 2
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