Industry Directory | Distributor
Cupio provides and supports equipment for some of the world's top suppliers of test and inspection equipment aimed at production inspection and repair test.
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
First of all, It is so pleasure to contact your company We,TSM soldering machinery,are looking for distributor covering regional country for ele/semicon.industrial assembly application Let us introduce ourself shortly,if you can share business oppor
Electronics Forum | Tue Sep 18 09:06:33 EDT 2007 | russ
I would have to ask Matt, was just a thought
Electronics Forum | Wed Sep 12 22:57:02 EDT 2007 | lito_visaya
Anyone, We are an electronic assembly contractor and one of our customer requires a 100% solder coverage on pads for their products. We are using flex pcb and we mount only one component (LED for backlight application). The solder paste we are u
Used SMT Equipment | AOI / Automated Optical Inspection
(2) Orbotech Automated Optical Inspections Machines For Sale Machine were just taken out of Military OEM facility in good working condition Both machines are being sold together at discounted price See attached pictures and information below
Used SMT Equipment | SPI / Solder Paste Inspection
VisionPro Ap500 is the most accruate and simple to use benchtop SPI system on the market today. Cutting edge 3D sensing technology along with fully integrated SPC for quick access traceability makes the VisionPro AP500 the industries standard. Ful
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Career Center | Boise, Idaho USA | Maintenance,Quality Control,Technical Support
FLEXTECHS is seeking qualified candidates for SMT Equipment Technician position. This is a contract position at a semiconductor manufacturing company for candidates who are physically located in Boise, ID. Qualified candidates will have skills and
Career Center | Nashville, North Carolina USA | Production
MUST BE WILLING TO BECOME FULLY VACCINATED FOR COVID-19, OR QUALIFY FOR A RECOGNIZED EXEMPTION, TO WORK AT ACDI IF GOVERNMENT CONTRACTOR REGULATIONS ARE UPHELD. OUR COMPANY What we do day-in and day-out has a lasting, meaningful impact across man
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies
Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies SMTnet Express May 3, 2012, Subscribers: 25098, Members: Companies: 8863, Users: 33057 Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies
| https://pcbasupplies.com/koki-solder-wire-s03x7ca-72m-1-0-mm/
– 1.0 mm Anti Iron Tip Erosion Super Low Ag Flux Cored Wire Solder 72M series contain new and more active activator for improved wettability and new resin composition for better flux coverage
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
coverage and no overflow (Fig. 6). Any small coverage deficiencies or overflows can be corrected with adjustments of the assembly preload. The post-reflow solder BLT collapse can be adjusted by changing either the coining depth of the lid or adhesive
