Industry Directory | Manufacturer
S.B.TECHNOLOGIES provides Electronics Manufacturing Services with 0402 CHIP SMT Assembly,BGA, Thru-Hole PCB Assembly, Wave Soldering, Reflow Soldering, Mixed Technology Printed Circuit Board Assembly build to IPC-Workmanship Stand
Industry Directory | Manufacturer
Manufacturer of precision ultrasonic spraying systems for a myriad of applications. Our patented technologies produce micron size uniform droplets, creating ultra thin layers onto any size or shape substrate.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
New Equipment | Assembly Services
Hanwha HM510 SMT Assembly Line Hanwha HM510 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
Electronics Forum | Tue Jul 16 07:26:55 EDT 2013 | vishnudas123
Dear all, can we use metal screw driver for mixing of solder paste.what are the disadvantages. please tell me.
Electronics Forum | Tue Jul 16 08:39:05 EDT 2013 | cyber_wolf
The screwdriver can scrape pieces of the plastic jar off and contaminate the paste if you aren't careful.
Used SMT Equipment | Soldering - Wave
Vitronics Wave Soldering Machine Model: Delta 6622C Vintage: 2006 Lead-Free (SN100C) Internal Dual Spray Fluxer (2) Bottom-Side Convection Preheat Zones (1) Bottom-Side Cal Rod Preheat Zone (1) Top-Side IR Preheat Zone Cast Iron Solder Pot Mix of L a
Used SMT Equipment | Soldering Equipment/Fluxes
The Opus 3 is a four-axis Cartesian Robot designed specifically for selectively soldering through-hole and odd-form components into surface-mount and mixed-technology printed circuit boards from the bottom side without inverting the PCB. The Opus 3 w
Industry News | 2012-09-13 09:35:40.0
GPD Global will exhibit in Booth #435 at the upcoming SMTA International Conference and Expo,
Industry News | 2012-06-11 12:24:54.0
GPD Global announces that it will exhibit in Booth #6085 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Parts & Supplies | Solder Paste Mixers
Solder Cream Mixer Feature of Solder Cream Mixer Excellent for ISO 9000 solder paste mix process condition. Strong mixing power. Increasing printing quality. Cream Solder Mixer Led display panel and microprocessor control, easy to operate. Unive
Parts & Supplies | Solder Paste Mixers
Solder Cream Mixer Feature of Solder Cream Mixer Excellent for ISO 9000 solder paste mix process condition. Strong mixing power. Increasing printing quality. Cream Solder Mixer Led display panel and microprocessor control, easy to operate. Unive
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Technical Library | 2014-05-22 17:10:37.0
In this paper, the general solution model of Chou has been used to predict the integral enthalpies of mixing of liquid In-Sn-Zn ternary alloys in five selected sections, xIn/xSn = 0.15/0.85, 0.34/0.66, 0.50/0.50, 0.67/0.33 and 0.85/0.15. The other traditional models such as Kohler, Muggianu, Toop and Hillert are also included in calculations. Comparison with literature data was done and showed reasonable agreement with Toop and Hillert asymmetric models.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Fri Jan 11 00:00:00 EST 2019 - Fri Jan 11 00:00:00 EST 2019 | Richardson, Texas USA
SMTA Dallas Chapter - Understanding Selective Solder Technology
Events Calendar | Wed Oct 20 00:00:00 EDT 2021 - Wed Oct 20 00:00:00 EDT 2021 | ,
Penang Chapter Virtual Vendor & Technical Day
Career Center | Kirkland, Portsmouth N.H Canada | Quality Control
Contract Electronic Manufacturer of PCB Assemblies seeks experienced QA Inspector with CLUSO VISION SYSTEMS First Article Inspection experience. Excellent communication skills. Computer literate, strong sense of urgency, and motivated with good follo
Career Center | Boca Raton, Florida USA | Engineering
Production Manager/Engineer NAV-TV located in Boca Raton fl. seeks an experienced Production Manager/Engineer. Ideal candidate will be SMT programmer/operator for pick-and-place equipment in a manufacturing environment, have experience programming,
Career Center | Delton, Michigan USA | Engineering,Maintenance,Production,Technical Support
IPC Master instructor with a number of years experience in Engineering as well as Machine technician.
Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing This work covers two major projects aimed at increasing quality and efficiency on a high mix, low
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1048.html
)All-stainless steel tank, clean convenience. 5)The solder dross separation machine with 316 grade stainless mixing bowl with an 10kg capacity with heating power for complete mixing. 6
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Finally, ensure that you are not mixing old and new flux, and that the flux you are using has not expired. Stencil – When a stencil is not properly cleaned, residue can accumulate and result in solder bridging defects in subsequent printings
