Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 15 years, QYSMT has been committed to meeting the needs of customers and partners. Our mission is to provide the best solutions while helping to reduce costs and increase efficiency.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Sat Jan 12 11:47:25 EST 2019 | ranap121212
I am looking for a good material for selective nozzle. We are currently using Kovar but it is expensive and wears out it has very good wetting properties.I looking for a material or coating that would allow me to keep the binder flow and with less co
Electronics Forum | Fri Dec 10 01:02:36 EST 2010 | sparrow
Hello, our products are made on single-sided boards and we often have problems with receiving too warped PCBs from our suppliers. Can anybody suggest a good laminate or the most important properties of the material so we could specify it when we orde
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | Soldering - Selective
This machine will be coming available for purchase soon. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version
Industry News | 2014-04-11 12:49:57.0
Heller Industries was announced the winner of the Circuits Assembly 2014 Service Excellence Award in the category of Reflow Soldering Companies.
Industry News | 2015-05-18 10:27:49.0
Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015.
Parts & Supplies | Other Equipment
SAMSUNG Nozzle List Brand Machine Model Specification Material of nozzle tip SAMSUNG CP30 M1, M2 , M3 Tungsten steel SAMSUNG CP33 XG05 / XH08 / XI14 / AA24 / BA40 Tungsten steel SAMSUNG CP40 N045 / N08 / N14 / N24 / N40 / N75 Tungsten steel
Parts & Supplies | SMT Equipment
(Currenly, our factory have a new batch of SMT spare parts with very good advantage price, if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. ) Email: alice@ksuns
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,
Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
Career Center | Rolling Meadows, Illinois USA | Quality Control
Job: PCB Assembly/Soldering Instructor Responsibilities: Provide instruction to students in IPC classes IPC-A-610, IPC JSTD-001, IPC 7711/21, IPC-A-620 Provide instruction to students in BEST classes Provide course content for and instruction to stu
Career Center | , | 2018-02-12 15:39:39.0
MR PCB Rework Technician (Intel Contract Employee) Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions,
Career Center | kemaman, malaysia Philippines | Maintenance,Production,Technical Support
• Conduct repairs and troubleshooting of production equipment to avoid / minimize production downtime. • Performs preventive maintenance of production equipment as defined in work procedure and according to their schedule of frequency. • C
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
| https://ipcapexexpo.org/education/call-for-technical-paper-form
Manufacturing Services Novel Solder Deposition Methods Process Best Practices Reflow Ovens and Profiling Rework Process Robotic, Laser and Selective Soldering Processes Stencil Printing Surface Mount Technology (SMT
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6008.html
+P HEAD 00384696-02 SERVICEBOX NOZZLE 20Segm. C+P HEAD 00384697-01 Servicebox Nozzle 6-Segm. C+P Head 00384802-02 Material for Failure Analysis, English 00384820-01 forked light barrier 00384850-01 magnetic valve 00385101-01 CABLE CHANNEL 30x45x300 00385143-01 Board- DCM-INT1 Ref
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