Industry Directory | Manufacturer
A materials supplier to the electronics industry. Our breadth of products includes Solder Paste, Solder Preforms, Stencils, Liquid Soldering Flux, Soldering Alloys, Cored Wire, Adhesives, Cleaners and Sinter Technologies
Industry Directory | Manufacturer
Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.
New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Sun Feb 27 13:42:44 EST 2005 | pmdeuel
So true, We had paste flux supplied to us from Alpha metals. It was the same as used in the solder paste. The major problem we noted was the in ability to control the ratio of paste to flux resulting in lots of voids. When we mixed enough to get the
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Industry News | 2003-04-01 08:40:24.0
Using environmentally safe solvents these machines offer two-stage, multiple-frequency ultrasonic cleaning, rinsing and drying for pcb defluxing, cleaning of precision parts and metal degreasing.
Parts & Supplies | Other Equipment
SMT Printer Squeegee MPM 125 MPM 125 Printer Squeegee 1.for MPM screen printer, 2.stainless steel blade 3.Size 219/254/300/304/355/400/450/508 4.Accurate durable 5.Abnormal is ok In order to enhance the control of the pre-placement prin
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Parts & Supplies | Screen Printers
DEK Screen Printer Use 137516 215607 DEK Board Clamp Dek 137516/ 215607 Board Clamp 500mm Dek Clamper 380mm/350mm/250mm 5157438/ 178031/177061 Description: DEK BOARD CLAMPER Part No: 137516/ 215607 Condition: original new /original used Appl
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2015-08-25 13:51:27.0
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.
ETA LED Laser Marking Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. LED Laser Marking Machine,Led Bulb Laser Machine,LED Bulb Fi
link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html The automatic PCB magazine loader is used at the starting of the SMT production line for loading of PCBA to the line.he unit loads the production line automatically by pu
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
SMTnet Express, October 15, 2015, Subscribers: 23,684, Members: Companies: 14,684, Users: 39,145 Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
). The BGA components were soldered to daisy chained test boards using matching alloy solder paste, and subsequently thermally cycled in accordance with the IPC-9701 attachment reliability guideline
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
don’t want solder balls, don’t use solder paste because we did not have that many little tiny solder balls before, and we are not going to accept the condition now. Yup
