Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Manufacturer
The Future of Electronics is here - With Squink at your Desktop, print and assemble PCBs in minutes instead of weeks for less than a cup of coffee. Go from CAD design to PCB without the pain and cost.
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder paste printing, SMT process, reflow soldering and wave solderi
Electronics Forum | Thu Nov 03 09:20:29 EST 2005 | russ
Unforunately, the only one who can give you that answer is the manufacturer. They are the only ones who know what is in their paste and how it reacts to different situations and conditions.
Electronics Forum | Thu Nov 03 08:34:25 EST 2005 | Slaine
Hi We currently use a small amount of Alloy : 43Sn 43Pb 14Bi Flux: RMA-51AC, Metal : 88.5%. We use it for reworking a product and only consume about 100g per year, we are in the middle or ordering in some more paste but the MOQ is 500g. Is it possibl
Used SMT Equipment | SPI / Solder Paste Inspection
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2013-01-16 19:22:48.0
GPD Global will exhibit in Booth #2633 at the upcoming IPC APEX EXPO. Live demonstrations will be given for a number of systems from the company's dispensing line.
Parts & Supplies | Assembly Accessories
Supply SMT Fuji placement machine accessories FUJI XP242 Feida interface board ADEEE6700 ADEE6700 Supply SMT placement machine accessories JUKI CB thimble L = 64.10mm Supply SMT Fuji FUJI placement machine QP electric Feida 24MM cover AKDDC6561 AKD
Technical Library | 2020-10-27 02:02:17.0
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.
Technical Library | 1999-05-06 15:31:13.0
Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Smt Semi-Auto Screen Printer Stencil Printer PCB screen printing machine Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45 degre
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Fort Lauderdale, Florida USA | Production
About Us URtech Manufacturing is a North American provider of end-to-end Electronic Manufacturing Services (EMS) to OEMs since 2010. Our services extend from product concept to commercialization, supporting the entire product life cycle. We build
Career Center | Davenport, Iowa USA | Production
SURFACE MOUNT SOLDERER - COOLERS Cobham Mission Systems is seeking a Surface Mount Solderer for our Coolers Department within our Davenport, Iowa facility. This position is open due to an increase in staff. The qualified applicant will perform the
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) SOLDER PASTE APPLICATION (WHEN AND AS SPECIFIED) Select
Dross and the Selective Soldering Process Dross and the Selective Soldering Process In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction
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