When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Electronics Forum | Wed Oct 07 13:36:11 EDT 2020 | rieko
I tried to reply to your response, but the site locked the discussion? You gave the information on the bread pans. I was wondering a teflon bread loaf pan would work for SAC?
Electronics Forum | Tue Jun 01 19:42:46 EDT 2004 | Ken
The biggest fear is mixing the solder pastes and bar solder. Had a training program for teaching folks what the alloys are and how to read them. I have locked up the bar solder and use the buddy system to restock the pot. Put up many signs on le
Used SMT Equipment | Soldering - Wave
Operating System: Windows based Details: • Dual pot-Lead and Lead Free • Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder • Carbon Steel Solder pots with high temperature protective coating • A
Industry News | 2014-02-13 16:40:22.0
Kurtz Ersa North America will display the proven POWERFLOW e N2 at the IPC APEX EXPO. The compact full tunnel wave soldering system significantly reduces solder consumption as well as the unit cost attributable to the process.
Industry News | 2013-11-27 11:26:06.0
Kurtz Ersa North America announces that Gorilla Circuits purchased a POWERFLOW N2 Full Nitrogen Tunnel Wave Solder Machine and VERSAFLOW 3/66 selective soldering machine.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University
SMTnet Express, August 12, 2021, Subscribers: 26,820, Companies: 11,423, Users: 26,800 Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board In this article