Industry Directory | Equipment Dealer / Broker / Auctions
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Industry Directory | Manufacturer
Modular pick and place automation - tape and reel - tube feeder - coplanarity check - assembly machine - contactless pick and place
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Mon Mar 03 10:39:19 EST 2003 | marys
How do I determine what the quality performance specifications are for my SMT equipment?
Electronics Forum | Mon Dec 15 11:28:26 EST 1997 | Mr. Paul R. Graham
I require a Template for an internal Solder Paste Stencil Specification. If any one has ANYTHING, could you please reply. Graham
Used SMT Equipment | Board Cleaners
Details: • 20" Belt Conveyor • 10 HP Hurricane Wash & Rinse Sections • 3 Turbine Dryers (Sonic Air) (2)15HP & (
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Industry News | 2015-11-12 22:03:28.0
Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!
Industry News | 2016-02-27 22:11:00.0
GPD Global has advanced its auger pump technology with the introduction of the newly developed Precision Auger Pump. This pump was designed to offer a wide range of functionality in your process development by being compatible with a wide range of auger/cartridge assemblies.
Parts & Supplies | Screen Printers
Steel frame specific conversion Steel frame specific conversion Name: steel frame-specific conversion Convertible Specifications: 736 × 736 may be converted to: 650 × 550 or 580 × 580 or 520 × 420 or 470 × 370
Parts & Supplies | Screen Printers
Steel frame specific conversion Name: steel frame-specific conversion Convertible Specifications: 736 × 736 may be converted to: 650 × 550 or 580 × 580 or 520 × 420 or 470 × 370 Applicable models: For large turn a small steel mesh steel mes
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Tue Aug 11 00:00:00 EDT 2020 - Tue Aug 11 00:00:00 EDT 2020 | ,
SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Las Vegas, Nevada USA | Engineering
We are looking for a Process Engineer or Manufacturing Engineer with at least 3 - 5 years exp. in a production or engineering enviroment. *Must be able to effectively interact with engineering and production to develop assembly procedures, test re
Career Center | La Crosse, Wisconsin USA | Maintenance,Production,Quality Control,Technical Support
Ability to read,comprehend and troubleshoot ele- ctronic components using blue prints or schema- tics.
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/1913-MarkIII-SPECS.pdf
Reflow Oven Specifications HELLER INDUSTRIES, INC. Heller Reflow Oven Specifications Model 1913 MARKIII (Air) 1913 MARKIII (Nitrogen) Electric Supply Power Input
GPD Global | https://www.gpd-global.com/pdf/doc/SimpleCoat-Series-Facility-Specifications-23100603.pdf
SimpleCoat-Series-Facility-Specifications-23100603.fm Facility Specifications for SimpleCoat Series Conformal Coating Systems Revision notes General specifications Date Version Notes 08/12/2020 1.0 Original issue. 12/07/2020
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