we working in Electroinc Stabilisers and UPS's and Protection Items for electrical equipments and protect from Under and over voltage and spikes which make problems with appliances and also in solar systems
Industry Directory | Other / Manufacturer
Reduce electrical overstress (EOS) with our EMI filters for soldering, power, ground and servo motors. EMI filters improve equipment up-time and reliability and reduce test problems.
High Precision Fpc / Pcb Punching Machine, Automatic Pcb Depaneling Equipment, CWPE 1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2. Cast iron framework for rigidity. Punching dies are changeable. Easy s
Electronic Pcb Punching Machine FFC LED Alum Board Punching Pcb separator features : 1 . Depaneling PCB / FPC by means of punching dies , to avoid micro-cracks caused by manual . 2 . Cast iron framework for rigidity. Punching dies are change
Used SMT Equipment | Soldering - Reflow
Heller 1810 MKIII Reflow Oven Vintage: 2014 Forced Convection Reflow Oven with the following features and benefits: Mesh Belt Edge Rail 10 zone oven 2 Internal Cooling Modules with 30” of Cooling
Used SMT Equipment | Soldering - Reflow
Weblink to several images: https://www.dropbox.com/sh/3pxqdpyy6867kmj/AACzuels141C_fxXf0hu5PDha?dl=0 2043MK5: Ultra Low Power Consumption Convection dryer Oven original price at $122,776.00 1.100% Forced Convection Reflow Oven with the following
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2010-10-30 01:14:50.0
Despite economic setbacks in 2009, the world market for electronics manufacturing services (EMS) is returning to double-digit growth, according to a study recently released by IPC — Association Connecting Electronics Industries®.
Technical Library | 2000-06-27 10:27:05.0
This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile.
Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
Features: 1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries; 2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous securit
An easy to use profile recorder and advanced oven setup software. Get an accurate profile and suggestions for the best oven setup with this dual capability profiler. Learn more at http://kicthermal.com/profilers/x-5
Career Center | Chennai, Tamil Nadu India | Engineering,Maintenance,Production,Research and Development,Technical Support
Over 5.5 years exp in Customer service on SMT Roles and Responsibilities Identify, improve, recommend, and implement measures to improve production methods, equipment performance, process capability, and product quality. Streamline manufac
Career Center | Puducheery, Tamil nadu India | Production
________________________________________V. KIRUBAKARAN SMT Production Engineer Mobile: +918925842383 | E-Mail: gvkirubakaran@gmail.com Passport Number: M6034648 | Issued date: 05 February 2015 | Expiry date: 05 February 2015 ___________________
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/foaming?con=t&page=3
Nordson SEALANT EQUIPMENT Control 2K foam materials at point of dispense with no drool, pressure spikes or mixing irregularities. International Dispensing
| https://www.eptac.com/soldertips/calibration-of-soldering-irons/
. There is an appendix in J-STD-001 that specifically addresses soldering irons, voltage spikes and temperature considerations. It is Appendix B. In particular you might want to familiarize yourself with Section B-2 Benchtop and Hand Soldering Systems, focusing on Item B
