Industry Directory | Manufacturer
Design, manufacture and distribute coaxial connectors, cable assemblies
SMA, SMB, MB, MCX, MMCX, MINIATURE PLUGS and RECEPTACLES. SMA connectors are used in high frequency and microwave applications.
Electronics Forum | Thu Mar 12 21:14:16 EDT 2009 | davef
Mask: * I/O connector contact surfaces * Bus connector contact surfaces * Configuration jumper blocks * Test points * Surfaces that contact heat sinks (heat sinks are removed prior to coating) * Board mounting holes * Adjustable potentiometers * P
Electronics Forum | Thu Feb 01 09:09:10 EST 2018 | deanm
I'm not sure if your customer will allow it but consider sealing the perimeter of the connector where it meets the board with some kind of sealant or staking material. Cure it then apply tape on top of it. Then all you have to do is remove the tape a
Used SMT Equipment | Pick and Place/Feeders
Hitachi Mounter SIGMA G5 Features: SIGMA G5 models can be mounted spotlights television sets, LED lamp shade, and is the only ultra-fast, turret structure mounted transparent lamp placement machine! Hitachi SIGMA G5 parameters Mounting head st
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight N4431B Agilent/HP N4431B ECal Module, 9 kHz to 13.5 GHz, 3.5 mm, 4-port The Agilent N4431B RF electronic calibration (ECal) module makes calibration of vector network analyzers fast, easy, and accurate. ECal is a precision, sin
Industry News | 2003-06-12 08:48:13.0
Richardson Electronics named first worldwide distributor
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Parts & Supplies | Pick and Place/Feeders
Email= happy@qy-smt.com Wechat= hpy246322 Skype= h4happyraj ------------------------------------ E9626729000 DRIVER(FOR 4 SHAFT MNLA) E9626901000 PRESSURE CONNECTOR E9627252A00 CONTACT E9627727000 CCD CAMERA CS4200J E9627729000 Z/THETA D
Parts & Supplies | Assembly Accessories
SMT MACHINE SPARE PARTS JUKI 2050 2060 2070 2080 FD FLOAT(RF) RECEIVE SENSOR HPB-R1 40002135 JUKI Nozzle Specifications: Brand Name JUKI FEEDER FLOAT (RF) SENSOR Part Number 40002135 Model Number HPB-R1 Ensure Tested buy juki Guarantee 1 mo
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
ALL-IN-ONE: JOT G3 Final Tester. It enables fully automated tests of mechanical, RF, electrical, audio, and visual interfaces.
New Production Test Solution for Smart Devices
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Brooklyn, New York USA | Engineering,Management
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
Advanced Electronic Connector Technologies News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Advanced Electronic Connector Technologies Military electrical connectors have
Advanced Electronic Connector Technologies News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Advanced Electronic Connector Technologies Military electrical connectors have
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
............................................................................23 5.4.3 Solder preforms ..........................................................................................24 5.5 Assembly of connectors to RF coaxial cables..........................................................25
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/hot-bar-reflow-soldering-systems
Hot Bar Reflow Soldering Systems | Nordson DIMA DIMA Products Corporate | Global Directory | Languages Division Only All of Nordson Hot Bar Reflow Soldering Systems Flex carriers and foil connectors Mobile electronics such as telecommunications equipment, as well as the electronics in motor