Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer
Manufacturer of precision ultrasonic spraying systems for a myriad of applications. Our patented technologies produce micron size uniform droplets, creating ultra thin layers onto any size or shape substrate.
New Equipment | Wave Soldering
Economical reciprocating ultrasonic spray fluxing system for medium to high mix lines. Sono-Tek is the originator of ultrasonic spray fluxing for wave solder fluxing. The SonoFlux name is an industry standard for ultrasonic spray fluxing around the
Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
Electronics Forum | Sun Aug 25 07:15:55 EDT 2002 | cnoonan
What are the industry standards for eutectic solder-paste in conjunction with the life span of solder-paste. What is the recommended duration of solder-paste on a printed circuit board. Example: You print a board, how long can it sit before runnin
Electronics Forum | Tue Dec 09 10:46:58 EST 2003 | Peter
Hi. Is there anyone with experience in soldering standard smd on a pvd (physical vapor deposited) titanium surface? Are there any rules to obey? Especially concering solder paste, surface treatment, reflow profile and oven etc. Thanks
Used SMT Equipment | Soldering - Wave
Model: 6622CC Vintage: 2006 Details: • Windows 7 operating system • Lead Free capable (was running lead, and will need tin wash). • 18” max width adjust • Measured Values Read-out of Frequency controlled motors on PC screen • 400V / 3 Phase
Used SMT Equipment | Soldering - Reflow
The 1800 reflow oven models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformi
Industry News | 2011-01-12 17:48:44.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Technical Library | 2013-12-19 16:57:50.0
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even though military hardware is considered exempt from the requirements of RoHS. As the supply chain has moved to the new lead free alloys both markets are being forced to understand these impacts and form risk mitigation strategies to deal with the change. This paper documents the effect of mixing Leaded and Lead Free alloys on BGA devices and how this impacts reliability. Three of the most common pitch BGA packages are included in the study to determine if the risk is the same as pitches decrease
The ZEVAm+ selective soldering machine brings patented soldering technology that excels at meeting the challenges of miniaturization. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results for the ever decreasing pitch
RCM-H1000D series Desktop automatic centrifugal mixer-temperature recovery type One.piece use clause H1000D desktop automatic centrifugal mixer is based on current technology and safety standards: GB4793.1-2007 "Safety requirements for electrical eq
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Akron, Ohio USA | Production
Job Description: � Responsible for the operation and process design of a SMT manufacturing line � Utilizes experience and engineering concepts to maximize quality and productivity � Documents processes and implements process controls for high reliab
Career Center | Rosemont, Illinois USA | Management,Production,Quality Control,Research and Development
For Philips, improving lives with light goes back to our founding fathers in 1891. At Philips Lighting, we carry this tradition forward, across all three domains: Healthcare, Lifestyle and Technology. Through a huge array of products, and variety in
Career Center | Delton, Michigan USA | Engineering,Maintenance,Production,Technical Support
IPC Master instructor with a number of years experience in Engineering as well as Machine technician.
Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support
9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing This work covers two major projects aimed at increasing quality and efficiency on a high mix, low
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5454
Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb or In 中文 MEMBERS LOGIN Membership Become a Member
| https://www.eptac.com/webinar/faqs-clarification-and-interpretation-of-a-variety-of-ipc-standards/
. Topics we will be reviewing are: Lead vs. Lead Free solders on gold plated boards. Product operating in high-temp environments exceeding liquid solder states
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
