Industry Directory | Consultant / Service Provider / Manufacturer / Other
MET is ready to meet your stencil requirements. We manufacture Electroformed Stencils, Laser Cut Stencils and Chemically Etched Stencils for various solder paste and glue printing applications.
Industry Directory | Manufacturer
FP Stencil Sdn. Bhd. is principally involved in the manufacture and sale of laser-cut metal surface- mount technology (SMT) stencils. Our products comprise of PCB stencils, wafer stencils, mini stencils, & accessories.
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
2.0 Cpk @ +/- 12.5µm, (±6 Sigma) * Process Alignment Capability >2.0 Cpk @ +/- 25µm, (±6 Sigma) * Standard cycle time 10 seconds + process Maximum printing surface 508 mm (X) × 508 mm (Y) User interface Touchscreen, keyboard a
Electronics Forum | Fri Feb 24 08:29:25 EST 2006 | davef
Step stencils are not widely used, due to: * Higher cost as compared to uniform thickness stencils * Danger of solder paste smearing at least close to the steps * Difficulty of cleaning the stepped stencil underside (the steps cannot be on the upper
Electronics Forum | Thu Feb 23 19:55:30 EST 2006 | pjc
Not sure on stepped stencil designs, very application specific. Try consulting with your stencil supplier. Most of the big suppliers have applications engineering support. You can send them your board data and they can review and advise. Also, consid
Industry News | 2013-06-26 09:09:19.0
The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Parts & Supplies | Assembly Accessories
FUJI-PIN-PM04372 Dek tooling pins 197785 Support pin 9498 396 00068 SUPPORT PINS 9498 396 00069 CHAIN 35 SINGLE PCS STL EXPIN 10 FT 2010 5292035 pin ADNPH8180 Probe pin G1353 Support Pin 00119680 Spindle Fixtu
Parts & Supplies | Pick and Place/Feeders
K87-M1199-00X K87-M1199-10X YAMAHA FV Feeder small one-way wheel Other parts: KHY-M9129-00 Sanyo Patch Machine with Cutter 4797L PIN(1011348033) 80004705 Vacuum solenoid valve / vacuum valve 4797A image card 6300853681 RH3 2.5 mm Feeder 80004802
Technical Library | 2015-08-25 13:51:27.0
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Career Center | Hawthorne, California USA | Engineering
SMT PROCESS ENGINEER (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
