Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Wed Jun 26 08:54:53 EDT 2002 | davef
it has a lousy gage. * Solderability testing machines from different suppliers produce dissimilar results. * Tests don�t well represent in-use. For instance, how does one test the solderability of a BGA? [Ooo, ooo. I know the answer. => For BGA and
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2021-10-31 05:01:48.0
Seika Machinery, Inc. is excited to announce its participation in multiple committees during the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Seika will have leading equipment on display, in addition to participating in the MSD Council Meeting and Women's Leadership Program.
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. Statistical T-Test for Solder Joint Voiding Showing Indistinguishable Failure Populations [7] Study #4: S. Sethuraman et al, “The Effect of Process Voiding on BGA Solder Joint Fatigue Life Measured in Accelerated Temperature Cycling” [8
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Pradeep Lall, Ph.D., et al. Abstract 23-2 Mechanical Failures in Pb-Free Processing: Evaluating The Effect of Pad Crater Defects on Process Strain Limits for BGA Devices John McMahon and Brian Gray Abstract 23-2 Lead-Free Flux Technology and Influence on
winsouce.jpg)