New Equipment | ESD Control Supplies
Formulated to clean stainless steel, formica, polypropylene, acrylic, glass and painted surfaces to the most rigid cleanroom standards. Double bag packaging is available for cleanroom applications. Available in quart and gallon bottles. 4 gallons
New Equipment | ESD Control Supplies
Formulated to clean stainless steel, formica, polypropylene, acrylic, glass and painted surfaces to the most rigid cleanroom standards. Double bag packaging is available for cleanroom applications. Available in quart and gallon bottles. 12 individ
Electronics Forum | Thu Nov 16 06:13:16 EST 2000 | Adam Seychell
I am currently building a home PCB etching tank based on the ammonia/ammonium sulfate chemistry. The etching system consists of a etching tank, and an electrolytic copper recovery tank. The result is a infinitely replenishable etching system without
Electronics Forum | Thu Nov 16 07:32:51 EST 2000 | R Missimer
I have seen several patents on this process, and would discuss with you my understanding. I would also be interested in how things worked out for you, and your findings overall. Please advise RMissimer@ieee.org
Industry News | 2017-11-30 00:52:06.0
Recently, Nickel metal prices continued to surge. The Futures Nickel prices of London Stock Exchange hit a 28-month high and the nickel metal prices of Shanghai Futures Exchange was a strong closing limit yesterday.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Electroplating, Stripping, and Etching With the conductive pattern and drilled holes exposed, the panel is placed into a copper plating bath containing sulfuric acid and copper sulfate
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=38
. Typical ions accounted for have included chloride, bromide, nitrate, sulfate, weak-organic acid (WOA), sodium and ammonium. Environmental and other concerns have driven the industry to adopt myriad flux formulations, which has created a need to further differentiate weak-organic acids beyond what a typical IC system can provide
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