Our leading products are researched, developed and manufactured at Keteca USA, in Phoenix Arizona. Solution to bonding problem? Keteca Diamaflow is the Answer! The Sub-Micron Technology of today and the future requires continued improved methods to
New Equipment | Solder Materials
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Electronics Forum | Fri Oct 08 20:23:23 EDT 1999 | Bix
Can anyone tell me the formula/method to determine the amount of weight that solder's surface tension can support. (ie: Maximum weight of components soldered onto a bottom side of a board during a top side reflow on a Paste/Paste process). Thanks, S
Electronics Forum | Wed Oct 13 14:42:39 EDT 1999 | John Thorup
Brian You're quite right. I frequently break this formula. The source recommends it as an almost assured success rather than an absolute. Given all the variables involved Steve should use it as a reality check and then just see what works. John T
Industry News | 2003-06-18 08:04:27.0
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Industry News | 2002-05-09 09:21:34.0
Featured in Its Century Selective Flux Dispensing System
Parts & Supplies | Component Packaging
ET1589L-8CJA-1-G YAMAHA YG200 surface mount parts Touch Monitor 15.0 KGT-M5109-032 We have original new & original used Touch Monitor for SMT Pick and Place Equipment , We also have repair service ET1589L-8CJA-1-G Touch Monitor 15.0 KGT-M5109
Parts & Supplies | Chipshooters / Chip Mounters
7WL ASSY (ø1.2 / 0.6) Issues related to improper nozzle/feeder maintenance or use of poor quality nozzles are often the same. Here are some of the most common problems: 1. Poor pickup location on part. It will cause a loss of vacuum and re
Technical Library | 2020-07-29 20:12:52.0
Aluminum is a metal that it is hard to solder due to the high surface tension difference between it and molten solder alloy. This occurs because aluminum rapidly forms a tenacious oxide layer whenever it is exposed to oxygen in the air. The oxide layer is responsible for the high surface tension difference between the aluminum and the solder and impedes the solder from spreading evenly on an aluminum surface. There are hundreds of aluminum alloys available in the marketplace; it is important to identify the form of aluminum that is being soldered. Once this is done, an appropriate soldering technique can be chosen for soldering the specific aluminum alloy under consideration. Direct aluminum soldering eliminates using expensive plating techniques to prepare the aluminum surface for soldering.
Technical Library | 2022-10-11 17:27:08.0
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature, high alloy surface tension, miniaturization, air soldering due to low cost consideration, and environmental concern. Accordingly, the flux features desired included high thermal stability, high resistance against burn-off, high oxidation resistance, high oxygen barrier capability, low surface tension, high fluxing capacity, slow wetting, low moisture pickup, high hot viscosity, and halogen-free. For each of the features listed above, corresponding desired chemical structures can be deduced, and the impact of those structures on flux residue cleanability can be speculated. Overall, lead-free flux technology results in a greater difficulty in cleaning. Cleaner with a better matching solvency for the residue as well as a higher cleaning temperature or agitation are needed. Alkaline and polar cleaner are often needed to deal with the larger quantity of fluxing products. Reactive cleaner is also desired to address the side reaction products such as crosslinked residue.
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
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. This is due to the solder surface tension that forces components to align with the solder pads, reducing placement errors. Quality Control Because of
Imagineering, Inc. | https://www.pcbnet.com/blog/benefits-surface-mount-technology-smt-pcb-assembly/
. Here are additional benefits of SMT: Component placement autocorrect – The solder surface tension forces components into alignment with solder pads
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