Industry Directory | Consultant / Service Provider / Manufacturer
DigiProces takes care of every step in the development process, from early concept design to volume manufacturing, thanks to a perfectly integrated value chain
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
Electronics Forum | Thu Jun 27 08:49:10 EDT 2024 | SMTA-68896089
Does anyone know of a level of adoption of SPI use across the industry? Has there been any surveys that could indicate the level (%) take up?
Electronics Forum | Fri Dec 07 08:49:29 EST 2018 | duke211
I have a similar over and both in and exit should be the same distance apart. You can contact Heller for help. If you have maintenance manual if should tell you how to adjust the timing chain for the lead screws, I am assuming your over have three le
Used SMT Equipment | Chipshooters / Chip Mounters
The NXT III is a modular SMT mounter that is able to provide the best line every time for factories that have such kinds of frequent changes for producing electronics devices. Heads can be exchanged easily. Heads can be exchanged easily without tool
Used SMT Equipment | Pick and Place/Feeders
CP45FV NEO Popular CP45FV NEO. Highly Flexible, user friendly machine and highly reliable. Full vision with 6 placement heads, each with individual illumination allowing 6 totally different components to be aligned on the fly. Upward looking
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2013-01-11 07:05:56.0
GPD Global will exhibit in Booth #4357 at the upcoming ATX West Expo, schedule to take place February 12-14, 2013 at the Anaheim Convention Center in California.
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Parts & Supplies | SMT Equipment
Yamaha Spring Take Up (KW1-M229K-000) Jenny@ksunsmt.com
Parts & Supplies | Pick and Place/Feeders
SONY FEEDER PARTS Part Name：Lever,Positioning PART No：4-702-744-02 Part Name：Cover, Take-up reel (16MM外盖) PART No：4-702-920-01 Part Name：Cover, Take-up reel (56mm外盖) PART No：X-4700-069-1 Part Name：COVER ASSY, TAPE 8×2 G (X-4700-290-1) PART
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Technical Library | 2024-03-19 07:58:40.0
Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | , California USA | Engineering,Sales/Marketing
My client, is taking their Electronics Manufacturing Services (EMS) business to the next level. They have an urgent need for a National Director of Business Development, to head up the sales of new and existing business. This is the opportunity to
Career Center | Battle Creek, Michigan USA | Management,Production
A 1,000 person electronics manufacturer in Battle Creek, MI is looking to add an experienced manager to take over the function of Production Engineering. The position will be resposnible for the support of several business units and will manage up t
Career Center | , | 2013-01-24 13:12:30.0
Write now I am working as a Production Engineer of Mobile Charger and CFL.Assembling of componenens over PCB,Soldreing has to be done under my supervision.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2813&OB=ASC.html
Solder Joint Goals - Take II - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > Altium New Posts FAQ Search Events Register Login Solder Joint Goals - Take II
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