The DV-03 is a air-actuated balanced spool valve for consistent dispensing of high viscosity fluids. For precision, you can control the amount of fluid dispensed by adjusting the fluid pressure, pulse time, and selecting the appropriate dispense tip
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
Electronics Forum | Fri May 25 03:28:20 EDT 2007 | shparekh
Hi All, Brand new here. I am wondering if I can find a breakout board for 0.4mm pitch SMD connectors. TIA. -sanjay
Electronics Forum | Mon Oct 24 09:07:58 EDT 2016 | robl
Could you make up your own adaptor cable to connect to your programmer, then fit a small form connector like a Firewire on the edge of the PCB? It should only take up about 7x7mm of real estate as opposed to a 2.54mm 5x2 pin header 12.7 x 5.08, or a
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se
Used SMT Equipment | Pick and Place/Feeders
Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mmcomponents, the wide range of special-shaped long joint element The height of the object elementcorresponds to 25.5 mm 10 ~ 30 n can be easy to stick
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Parts & Supplies | SMT Equipment
FUJI NTX H04 2.5G FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 Tungsten steel FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 Tungsten steel FUJI CP6 / CP7 Bore diameter 2.5 / 3.7 / 5.0 Tungsten steel FUJI XP141 / 142 Bore diameter 2.5 / 3.7
Parts & Supplies | Assembly Accessories
DEK CYINDER CONNECTOR (107422) More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A SS23H-M5-D24-UPK Sensor H1124D FUJI XP242 243
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
Panasonic NPM-W2 Modular SMT Chip Mounter Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
Panasonic NPM W2S PCB Chip Mounting Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and p
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I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
