New Equipment | Solder Materials
OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting
New Equipment | Surface Finish
Increase Yields. Improve Quality. Reduce Rework and Rejects. Enthone provides the world’s most applied and preferred PCB final finishes. Offering the widest selection and deepest knowledge of lead-free compatible finishes, we work with leading OEMs,
Electronics Forum | Wed Dec 22 01:39:06 EST 2010 | boardhouse
Hi Johan, As a Asian board supplier - I would not recommend using Lead free hasl on any product that has BGA, you would be just looking for issues, flatness being the main. I agree with one of the other replies - Your purchasing dept. should not be
Electronics Forum | Wed Jun 22 15:03:12 EDT 2005 | patrickbruneel
The only thing ammonia can do is tarnish copper and make it more difficult to solder. And the higher temp in lead-free will discolor the latex (giving it a sticky surface), but the functionality of the mask will be intact. There should be greater co
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2012-11-26 14:04:53.0
The IDTechEx report The Market for Gold Inks 2013-2019 is looking to identify and assess the opportunities for a printable nano-gold ink, excluding its use in graphic arts applications (where it could be used for both its graphic arts benefits in addition to being used as a functional component in a circuit, such as printed touch switches, are taken into account). Save 25% online by quoting REP2012.
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. However, it contains lead, which isn’t RoHS compliant. A lead-free version of HASL is available, which is also cost-effective and reworkable
| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx
Höllmüller LPI Developer with flexible transport Pill Pre-Clean Mec Etch Bond for paint + inner layers Höllmüller Anti-Tarnish for inner layers Mec Laif Shadow Line - Direct Metallization Laif Resist Stripper with cyclone Schmid Tin Stripper Laif Ni/Au manual electroplating w/post-cleaning + dryer Laif Ni/Au – chem
