Electronics Forum: techniques mounted assemblies klein wassink (10)

Bottomside SOT23 opens & DOE test board layout

Electronics Forum | Thu May 24 19:19:20 EDT 2001 | davef

Try: * Poor looking solder connections * Good looking solder connections * Reliable solder connections Look to Ch 5 of "Manufacturing Techniques For Surface Mounted Assemblies"; RJ Klein Wassink & MMF Verguld; Electrochemical Pub; ISBN 0-901150-30-4

SMD solder joint calculation

Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef

No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.

Industry News: techniques mounted assemblies klein wassink (1)

UPMG Honors STI Electronics, Inc. with the Opening of the Jim D. Raby Hall of Fame

Industry News | 2012-06-04 16:10:02.0

STI Electronics, Incannounces that UP Media Group Inc. (UPMG), publisher of CIRCUITS ASSEMBLY magazine, has opened the Jim D. Raby Hall of Fame for Electronics Assembly.

STI Electronics

Express Newsletter: techniques mounted assemblies klein wassink (1093)

Partner Websites: techniques mounted assemblies klein wassink (4)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition, Electrochemical Publications, Great Britain, 310- 311, 1984. [3] Raiyo F. Aspandiar, “Voids in Solder

Heller 公司

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

. Klein Wassink, Soldering in Electronics, A Comprehensive Treatise on Soldering Technology for Surface Mounting and Through-Hole Techniques, 2nd Edition, Electrochemical Publications, Great Britain, 310- 311, 1984. [3] Raiyo F. Aspandiar, “Voids in Solder

Heller Industries Inc.


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