We make wave solder fixtures, smt, reflow fixtures, press fit and special tool for electronic assembly. We specialize in quick turn for prototype.
Industry Directory | Manufacturer
Our main core business is in manufacturing high precision tooling and machining parts for: Precision plastic mold insert fabrication Precision carbide punches & dies, jigs & fixtures Precision press tools and automation parts
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Press Fit Technology is the process of choice for many electrical engineering applications. Press Fit technology creates mechanically and electrically stable gaslight connections without the need for additional fastenings, soldering or thermal stres
From Powder to the Most Accurate Finished Parts Micro Tools, a division of ISCAR Ltd. company, is a subcontractor. We manufacture very accurate mechanical parts (tolerances of ● Various steels ● Ceramic (alumina and zirconium oxide) ● Tun
Electronics Forum | Sat May 17 10:38:49 EDT 2014 | sarason
I hate to say this but in all probability this wont work. I have built real strain gages and they depend on the change(Co-effiecent) of resistence with strain(or Stretch). since you are connecting you elements up with copper wire it will frm part of
Electronics Forum | Thu Aug 09 01:18:59 EDT 2018 | grek
Hello, i would like to ask you if it is there some kind of literature where i can find more about Press Fit Technology? I would like to learn more about this technology. I found great literature Einpresstechnik from Mr. Tilman Heinisch. But i would
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Used SMT Equipment | Chipshooters / Chip Mounters
KE3010 High-speed Placement Machine JUKI KE3010 High-speed Placement Machine Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machin
Industry News | 2003-04-08 10:28:06.0
A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.
Industry News | 2003-06-12 08:48:13.0
Richardson Electronics named first worldwide distributor
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Parts & Supplies | SMT Equipment
AP rear strut presses(P2945) Product Name: P2945APHIE; AP rear strut presses Part Number: P2945 Description: CYLINDER; GAS; P2945 APHIE; AP rear strut presses Applicable models: APHIE; AP CYLINDER; GAS; P2945 APHIE; AP rear strut
Parts & Supplies | SMT Equipment
Unidirectional / roll blade Name: MPM presses roll bar unidirectional blade wiping mechanism Part Number: roll blade Description: MPM wiping mechanism presses roll bar unidirectional blade, blade roll Applicable models: UP; AP Printing
Technical Library | 2016-10-27 16:24:23.0
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair. This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a
JUKI feeder calibration---ZK Electronic Technology Co., Limited
Events Calendar | Tue Apr 25 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Shanghai, China
SMTA China East Conference
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , Ontario Canada | Maintenance
Title: Technologist � Mechanical SMT (Position based in London, Ontario) Basic Purpose of Position: To set-up, operate, calibrate, program, troubleshoot and adjust surface mount and through-hole technologies PWB assembly, soldering and cleaning equ
Career Center | Milpitas, USA | Engineering,Maintenance
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a high energy, creative, hands-on electro-mechanical engineer to join our team. Thi
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Career Center | Muzzaffarnagar, India | Production
Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process
SMTnet Express, October 27, 2016, Subscribers: 26,530, Companies: 15,009, Users: 41,321 Press Fit Technology Roadmap and Control Parameters for a High Performance Process Jose Becerra, Dennis Willie and Murad Kurwa; Flex (Flextronics International
| https://www.eptac.com/about-us/press-releases/page/2
... Read More Press Release Precision Assembly Technologies, Inc. Partners with EPTAC... Manchester, NH — July 6, 2010 –EPTAC Corporation announces its partnership with Precision Assembly Technologies, Inc. (PAT
Lewis & Clark | http://www.lewis-clark.com/product-category/press/
Press Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
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