Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications The silver end termination plays an important role
SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company
