Electronics Forum | Thu Oct 26 12:56:50 EDT 2000 | ptvianc
That is a tough question. I think that an important point must be made, and that is that the electronics assembly business is just that, a business. And, electronics asssembly companies are in business to make a profit. The profit, or "bottom line
Electronics Forum | Wed Apr 18 20:41:59 EDT 2007 | Machine Designer
The point is that shift is all about adapting not doom and gloom. BTW: Thanks for the flame and insulting words Brett. Way to hijack a thread that merely pointed to some interesting facts that could create some interesting dialog. I was merely inviti
Industry News | 2003-02-24 09:47:35.0
Mark R. Hollinger, Chairman and CEO, will present at the Raymond James 24th Annual Institutional Investors Conference at 2:40 p.m. ET on Tuesday, March 4th.
Industry News | 2012-12-12 20:41:40.0
The Partnership was formed to provide awareness and training in the techniques and practices required to detect and avoid counterfeit components and the costs, legal issues and risks associated with them in order to prevent infestation of counterfeit material into the supply chain. There is an increasing volume of counterfeit electronic parts entering the aerospace supply chain and others, posing significant performance, reliability and safety risks.
Technical Library | 2019-12-30 02:09:39.0
How to choose the material of PCB ? The choice of PCB material must meet the design requirements, the quality of production and cost need to achieve a balance. The design requirements include electrical and institutional parts. This material problem is usually important when designing very high speed PCB boards (frequencies greater than GHz). For example, the commonly used FR-4 material may not be used when dielectric loss at several GHz frequencies, which can have a significant effect on signal attenuation . In the case of electrical, it is important to note whether the dielectric constant and the dielectric loss are combined at the designed frequency
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
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At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/tyndall-national-institute-trusts-nordson-dage-for-inspection
Inspection In late 2014, the Specialty Products & Services (SP&S) Centre at Tyndall National Institute was seeking to enhance its X-ray inspection capability with the purchase of a new modern system
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/
(formerly the Institute for Printed Circuits), is the most effective approach. The IPC, an internationally recognized electronics-industry standard , offers comprehensive best practices for every PCB design and production stage
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