Electronics Forum | Mon Dec 31 08:59:36 EST 2001 | Don Adams
The second pass in the wave is pretty extreme and will probably aggravate the conditions which caused warpage in the first place. Areas to look for problems, The lay up of the boards at fabrication or the materials used can lead to warpage. Work wi
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Industry News | 2021-01-05 11:01:03.0
New Vishay Siliconix 40V Automotive Grade MOSFET Provides Lower Thermal Resistance and a Lead Frame for Extended Board-Level Reliability
Industry News | 2016-10-17 18:20:25.0
PDR Americas today introduced the EMS industry’s first intra-ocular-adjustable ‘read zone’ thermal sensor for high-end rework. The rework-specific temperature sensor has been specifically engineered for rework environments, providing the accuracy and confidence needed for high-yield rework program success.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
SMTnet Express, May 7, 2020, Subscribers: 36,108, Companies: 11,001, Users: 25,793 Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components Credits: Nordson SELECT The selective soldering process has evolved to become a
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