Industry Directory: tin lead silver bga reliability (5)

Ludee Circuits

Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other

Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.

Hongkong Delta Electronics Technology Co.,Ltd

Industry Directory | Manufacturer

Professional, Reliable,High Quality,Low Cost, Rapid Delivery PCB manufacturer

New SMT Equipment: tin lead silver bga reliability (29)

NC275B No Clean Liquid Flux

NC275B No Clean Liquid Flux

New Equipment | Solder Materials

NC275B Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC275B can be used with all common lead-free wave soldering alloys in

AIM Solder

MIL Certified PCB Manufacturer

MIL Certified PCB Manufacturer

New Equipment | Assembly Services

PNC Inc. has been manufacturing hi-reliability printed circuit boards since 1968. All Military Spec PC boards are manufactured in the security of our Nutley NJ, USA facility. PNC is certified by the Department of Defense to Military Performance Speci

PNC Inc.

Electronics Forum: tin lead silver bga reliability (56)

Immersion silver leaching.

Electronics Forum | Fri Apr 09 20:28:14 EDT 2004 | Ken

I have experience in this. My company offers Lead free SMT and Wave soldering. I have processed ImSn, ImAg, Enig, OSP in both smt and wave. Yes, silver leaching will occur. Yes, copper leaching will occur. High tin content solders disolve everyt

Immersion silver leaching.

Electronics Forum | Wed Apr 07 09:23:20 EDT 2004 | davef

In addition to your concerns about leaching, why aren't you concerned about: * Tin whiskers * Total absence of in use reliability information about no-lead, especially given that creep is significantly different between SnPb and no-leads. While they

Industry News: tin lead silver bga reliability (156)

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)

Donald Tyler, Corfin, to Present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip” at the SMTA Capital Chapter Meeting March 17th

Industry News | 2015-03-11 18:05:46.0

The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.

Surface Mount Technology Association (SMTA)

Technical Library: tin lead silver bga reliability (8)

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Technical Library | 2009-01-15 00:42:58.0

Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.

Kester

Developing a Reliable Lead-free SMT Process

Technical Library | 2008-01-03 17:50:51.0

Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C.

Kester

Videos: tin lead silver bga reliability (5)

Automatic Soldering Robot?

Automatic Soldering Robot?

Videos

 Automatic Soldering Robot​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Automatic Soldering Robot,Benchtop Solder Robot,Soldering R

Dongguan Intercontinental Technology Co., Ltd.

RS series vacuum reflow oven RS220

Videos

At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec

Beijing Technology Company

Training Courses: tin lead silver bga reliability (2)

Advanced Electronics Manufacturing Processes Boot Camp (Boot Camp B)

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

BGA Rework/Profiling Training Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Events Calendar: tin lead silver bga reliability (3)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Surface Mount Technology Association (SMTA)

Career Center - Resumes: tin lead silver bga reliability (2)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: tin lead silver bga reliability (958)

SMTnet Express - September 9, 2021

SMTnet Express, September 9, 2021, Subscribers: 26,718, Companies: 11,435, Users: 26,839 Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates Manganese can

SMTnet Express July 18 - 2013, Subscribers: 26169

SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou

Partner Websites: tin lead silver bga reliability (80)


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