Industry Directory | Manufacturer
Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
New PEM® ReelFast® Brass Surface Mount Fasteners for PC Boards Provide Superior Electrical and Mechanical Attachment Points New PEM® ReelFast® brass surface mount fasteners from PennEngineering® introduce ideal hardware solutions for printed cir
Electronics Forum | Tue Dec 08 12:44:52 EST 2020 | janwillemreusink
Who is using two sorts of tin in one selective soldering machine with to solder pots? So then the soldering program selects the correct pot (tin). What are the risks? Adding wrong tin in the wrong pot. Mixing up the nozzles?
Electronics Forum | Thu Dec 17 18:24:37 EST 2020 | SMTA-64387520
We use both in our selective soldering machine. Training is the most important concern. As long as you have well trained operators the risk is minimized.
Used SMT Equipment | Circuit Board Assembly Products
The product introduction The SM-2009 scissors & pneumatic type separator, we use the most advanced non-stress idea to designed it, it’s help to prevent the chap phenomena as the PCB separated by the general separator, it’s improve the PCB’s quality
Industry News | 2012-03-26 15:58:58.0
Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.
Industry News | 2011-07-18 12:24:54.0
The Capital Chapter is pleased to announce the second technical presentation for their Expo and Tech Forum which will be held at the Johns Hopkins University, in Laurel MD on September 13, 2011.
Parts & Supplies | Soldering - Wave
Titanium solder pot liner for a Vectra 450F solder pot. Converting your wave solder to Pb Free? Use a titanium solder pot liner to avoid the costly tin flush and risk of contamination. FOB: Origiin Contact: Assured Technical Service LLC AssuredT
Technical Library | 2015-10-22 17:37:28.0
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic, polyurethane and parylene. Also included in this paper are tin whisker inspection results of tin-plated braiding and wire that was exposed to an environment of 50°C with 50% relative humidity for over five years.
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin
SMTnet Express, February 3, 2022, Subscribers: 25,970, Companies: 11,512, Users: 27,043 Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers If you've been in electronics for any length of time, the phenomenon
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/3-things-you-should-know-about-lead-free-soldering/
. Reasons Why Lead Solder Was The Preferred Solder Type Lead solder is an alloy commonly made up of 63% tin and 37% lead. It is sometimes referred to as Pb-Sn, its chemical formula
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-force-pull?con=t&page=10
. Please consult us for further details. Products Content Your results for: High Force Pull Creep testing of Tin Based Alloys Application Note Nordson DAGE 4600LF Data Sheet Nordson DAGE Dage - Kulicke and Soffa Case Study Nordson DAGE Micro Fracture of Glass Composites
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