Industry Directory: tinning gold leaded devices (26)

Advance Devices, Inc.

Industry Directory | Other

Advance Devices, Inc. offers Smart Tweezers LCR Meter - excellent tool for identification testing of SMD Components.

Delkin Devices, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Delkin Devices, Inc. is an independently owned business and the largest US memory card manufacturer in San Diego, CA.

New SMT Equipment: tinning gold leaded devices (55)

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

New Equipment | Surface Finish

Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed

Technic Inc.

Microwave RF PCB

Microwave RF PCB

New Equipment | Other

General specification for Microwave/RF PCB Layer count: 1-6 Board thickness: 0.2-3.2mm Copper thickness: 0.5-4oz Dielectric Constant(DK): 2.2-10.3 Min trace width/spacing: 4/4mil Min drill hole size: 0.2mm Surface treatment: HAL(Lead free), I

A-Tech Circuits Co.,Limited

Electronics Forum: tinning gold leaded devices (277)

Palladium leaded devices IPC610 class3 acceptable

Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125

We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th

Gold Leaded SMT devices

Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef

The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu

Industry News: tinning gold leaded devices (307)

IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest Offers Critical Information

Industry News | 2010-12-03 21:35:04.0

Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

IPC Solder Products Value Council Urges Tin Smelters To Engage In Certification For Conflict-Free Smelting

Industry News | 2011-10-21 13:55:23.0

IPC’s Solder Products Value Council (SPVC) is actively urging tin smelters to become smelters of conflict-free minerals and recommends the Electronic Industry Citizenship Coalition/Global e-Sustainability Initiative (EICC/GESI) Conflict-Free Smelter (CFS) program.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: tinning gold leaded devices (1)

Chimall pcb1

Chimall pcb1

Parts & Supplies | Circuit Board Assembly Products

PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic

PULANG TECHNOLOGY CO,.LTD

Technical Library: tinning gold leaded devices (10)

Masking and Underfill Dispensing for Medical Device

Technical Library | 2023-08-16 18:42:25.0

In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing

GPD Global

Gold Embrittlement In Lead-Free Solder.

Technical Library | 2014-08-07 15:13:44.0

Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.

DfR Solutions (acquired by ANSYS Inc)

Videos: tinning gold leaded devices (10)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

3D SPI manufacturer

3D SPI manufacturer

Videos

1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用

CNSMT CO.LTD

Training Courses: tinning gold leaded devices (1)

Rework of Leadless Devices Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Events Calendar: tinning gold leaded devices (2)

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: tinning gold leaded devices (5)

Sales Manager

Career Center | Shen Zhen, China | Management,Sales/Marketing

Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe

Sr. Process & Quality Engineer

Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support

Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.

Express Newsletter: tinning gold leaded devices (822)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

Horizontal Convection Reflow Technology Defined

Horizontal Convection Reflow Technology Defined Horizontal Convection Reflow Technology Defined Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct

Partner Websites: tinning gold leaded devices (51)

LEAD DELAMINATIONS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1058-lead-delaminations

. Tinning is sometimes done with a noble metal such as gold to improve the adhesion of bond wires. The problem is that some molding compounds do not adhere well to the noble metals

ASYMTEK Products | Nordson Electronics Solutions

PCB Prototyping: What Should You Be Looking For?

Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/

. Copper weights range from 1 to 4g. Finish plating can be leaded solder, or any following RoHS-compliant finishes: lead-free solder, immersion gold, immersion silver, white tin, or OSP

Imagineering, Inc.


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