Industry Directory | Manufacturer
Manufacturer of vapor phase soldering systems and associated products since 1985.
Industry Directory | Manufacturer
R&D Technical Services was formed in 1996 to support the Vapor Reflow market and is currently the leading source of Vapor Phase equipment.
The Company ASSCON Systemtechnik-Elektronik GmbH, was founded in 1995 as a development and manufacturing association for progressive and innovative Vapor Phase Reflow Soldering Systems. Today there are hundreds of ASSCON Vapor Phase Soldering System
New Equipment | Assembly Services
S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with
Electronics Forum | Thu Mar 13 14:12:31 EDT 2014 | davef
You're creating a new alloy on the surface of your board. The alloy will have a melting point determined by the constituent metals of the alloy. Your alloy consists of: * Lead-free HASL solderability protection on the board * Lead-free solder paste *
Electronics Forum | Wed Jul 10 16:34:23 EDT 2013 | hegemon
Preheating is critical in Vapor Phase Soldering. One trick that is done is to use the "soft vapor" area just above the soldering vapor, some machines can pause just before going into the soldering vapor. Using that pause above the vapor to continue
Used SMT Equipment | Soldering - Reflow
Make: Heller Model: 1809 EXL Vintage: 09-2007 Details: (9) Top & Bottom Heating Zones (2) Cooling Zones Windows 7 Operating System Edge Rail Conveyor & Center Board Support Air S
Used SMT Equipment | Soldering - Reflow
REHM Condenso Vapor Phase Reflow Oven Year 2008 Tension: 3 x 400V 50 Hz Power 20 kW Cooling 20 l/m Compressed air 8 bar Aspiration 400 m3/h Length 290 cm, Width 130 cm, Height 165 cm
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2019-08-12 20:03:57.0
MIRTEC, ‘The Global Leader in Inspection Technology,’ today announced that it will display its award-winning 3D AOI, 2D AOI and SPI Inspection Systems in booth #1C55 with Mir Tech-win at the upcoming NEPCON ASIA (NEPCON SOUTH CHINA) exhibition, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China.
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Nano-copper sintering in formic acid vapor.
The Centurion™ is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Longmont, Colorado USA | Engineering,Maintenance,Technical Support
FIELD SERVICE ENGINEER I JOB DESCRIPTION A-Tek Systems Group is an electronics equipment distributor specializing in factory automation – specifically with depaneling, vapor phase soldering, selective soldering and cleaning. A-Tek is headqu
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, March 20, 2014, Subscribers: 22559, Members: Companies: 13833, Users: 35907 Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering. Dipl.-Ing. Helmut Leicht; Andreas Thumm; IBL-Löttechnik Gmb
