Industry Directory | Consultant / Service Provider / Manufacturer
Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel, ESD trays for electronic components.
Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
Direct tray, modular, and multi-functional placement. 5,140 cph. 54 8mm reels. 40 trays. The Panasonic DT401 is a direct tray modular, multi-functional placement machine that's designed to give users the flexibility to place a large number of varie
Electronics Forum | Wed Jul 21 10:26:19 EDT 2010 | cyber_wolf
They define outer tray dimension and thickness. The array is specific to the component type.
Electronics Forum | Wed Jul 21 09:46:48 EDT 2010 | davef
Doesn't JEDEC define dimensions for trays, reels, tapes, etc?
Used SMT Equipment | Chipshooters / Chip Mounters
1999 Fuji IP-III SMT Pick & Place Note: This lot contains two items. (1) Fuji IP-III SMT Pick & Place Approx Dimensions: 126" x 78" x 78" (1) Fuji MTU-4R Tray Tower Approx Dimensions: 43" x 87" x 70" Location: Jasper, IN USA Serial: 1514 Features: o
Used SMT Equipment | Pick and Place/Feeders
OS: Windows XP Cycle Count: CTR1 45245085 CTR2 2848934 Includes Parts Tray Feeder Notes: The system will not power up. PTF motor elevator damage Main Unit damage Power supply 5V,12V Damages Serial: 10143531 Fea
Industry News | 2017-07-26 12:23:26.0
Count On Tools is pleased to announce that it has reduced pricing on the QWIKTRAY system from $699 to $499 each, with even lower prices on higher volumes. COT can provide these significant cost savings due to further development of the manufacturing process and reduced materials costs. The new pricing took effect July 14 2017.
Industry News | 2015-09-30 17:52:10.0
Count On Tools is pleased to announce the launch of the new QWIKTRAY system, developed to provide low-cost, custom matrix trays for many types of electronic components. The QWIKTRAY platform allows surface mount components to be picked up in a repeatable method when tape-and-reel is not available and standard JEDEC trays do not exist. Customers no longer have to place these components by hand.
Parts & Supplies | Assembly Accessories
YAMAHA Tray YAMAHA TRAY Exterior Dimension; 340 x 395 x 20mm Machine model compatible-- YAMAHA YV Pls feel free to contact me if you have any demand about SMT mechine and spare parts. Email:john@ksunsmt.com
Parts & Supplies | SMT Equipment
SAMSUNG SM421S Tray SAMSUNG SM421S TRAY Exterior Dimension; 300 x 345 x 150mm Machine model compatible-- SAMSUNG SM421S alice@ksunsmt.com
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Career Center | , | Engineering,Maintenance,Technical Support
Dear Sir/Madam, I am having the 10 years exprience in SMT field. Currently I am working in Service industry as Senior Engineer. Specially I am exprience and trained in FUJI and Speedline machines. Earlier I worked with Manufacturing Industry.