Industry Directory | Manufacturer
POLY-TECH Precision Industry Ltd. was set up since 2002,leading the unique and latest technology in manufacturing ceramic trimmer capacitor,specializing in producing SMD type 3mm, open type 5mm and 7mm and plastic casing
CP642 USED MACHINE: 1) 1996 YEAR, 2) NEW TYPE 3) GOOD RUNING 4) THE END 2009-03-30
New Equipment | Solder Materials
Made for high speed leaded assembly. No Clean Solder Paste, Alloy: Sn63/Pb37, Type 3 Powder -325+500, 250 gram jar. Buy one or two jars on line. While supplies last.
Electronics Forum | Fri Feb 28 15:27:50 EST 2014 | tombstonesmt
Good afternoon! Looking to see what everyone else in the industry is running for print speeds regarding type 3 solder pastes. Our paste is a type 3 with 11.5% ROL0 flux content. The finest pitch component in our case is .5mm pitch. Our screen print
Electronics Forum | Thu Nov 09 20:01:12 EST 2006 | AB
What are the pros and cons between type 3 and type 4 no clean solder paste (SnPb)?
Used SMT Equipment | AOI / Automated Optical Inspection
Make: Mirtec Model: MV-7 OMNI Year: 2020 Type: 3D AOI Specifications: Fully Functional LIKE NEW - Mirtec Reconditioned June 2024 Exclusive 15MP/25MP CoaXPress Camera System OMNI-VISI
Used SMT Equipment | General Purpose Equipment
Need SIEMEN Silver Feeder 3*8 Size Part number : 00141098-S07 Qty : 8 pcs Please send details : 1) Front & Back of Feeders 2) Close up showing the serial plate 3) Price CIF Singapore (for China supplier please send to SHENZHEN location) 4)
Industry News | 2003-04-15 08:39:15.0
Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)
Industry News | 2009-09-17 15:08:48.0
GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Parts & Supplies | Pick and Place/Feeders
Component Stopper Type 3, Vib. Feeder
Parts & Supplies | Pick and Place/Feeders
Power Supply Cable (plug in) for Type 3
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2020-10-27 02:02:17.0
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.
"Jet Printing Solder Paste and Cleaning Challenges" Register for the webinar today: https://pages.zestron.com/jet-printing-solder-paste-and-cleaning-challenges Recent evidence has shown that it is becoming extremely challenging to consistently deliv
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ The 1734-IB8S is a POINT Guard I/O Safety Module by Allen-Bradley and Rockwell Automation. It ha