Industry Directory | Distributor
Formed in 1990, we supply SMT Splicing Tapes & SMT Adhesives. We are the exclusive European & USA distributor for Fuji Chemical Industrial Co Ltd, Japan.
Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
Electronics Forum | Thu Sep 22 16:06:07 EDT 2011 | davef
Underfilling BGA is an uncommon practice. We'd start looking to find a consultant recommended by our: * Dispenser company * Underfill supplier
Electronics Forum | Tue Sep 20 08:53:13 EDT 2011 | jocelynlauzon
My company is looking for an IPC expert consultant in BGA underfilling to support an important contract that is being prepared. We are looking for someone with hands-on experience with large (~2"x2", with as much as 1800 pin, 1mm pitch, 0.5mm ball di
Used SMT Equipment | Coating and Encapsulation
Make: PVA Model: Delta 6 Vintage: 2014 Power: 240v, 25A, 60hz PSI: 80-100 3 Axis Fiducial Camera Belt Conveyor PCB Heat JDX + PVA Jet Controls (IO Card) Vacuum Purge Weigh Scale Machine was configured for Underfill, Flip Chip, BGA, Flex a
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Parts & Supplies | Chipshooters / Chip Mounters
SMT Nozzle for QP/QP132/QP242/QP341 FUJI QP242 INDEX SMT NOZZLE Part Number (OEM) Description ABHPN - 8510 ABHPN - 8520 ABHPN - 8530 ABHDN - 8560 ABHDN - 8570 ABHPN - 8590 QP-S-12 -ø 0.7 QP-S-12 NZ. ø 1.0 QP-S-12 NZ. ø 1.3 / 1.0 QP-M-38
Parts & Supplies | Pick and Place/Feeders
Panasonic nozzles available for MSF/MCF/HDP/HD/CM/DT Series MSF Series Nozzles Part Number Description PAMSFSSD Nozzle, SS (Diamond Tip) 1045 9080 04 Nozzle Tip Only, SS (Diamond Tip) PAMSFSD Nozzle, S (Diamond Tip) 1045 9080 14 Nozzle Ti
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2017-03-30 18:34:52.0
There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | Irvine, California USA | Sales/Marketing
We are a contract manufacturing company specializing in SMT, Thru-Hole and BGA assembly. Our niche is prototypes and medium volume. Visit our website at www.gmtechnical.com for our capital equipment listing and our capabilities. We are looking fo
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | , | Engineering,Technical Support
COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot
SMTnet Express, April 17, 2014, Subscribers: 22675, Members: Companies: 13858, Users: 36080 A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. In order to meet
SMTnet Express April 11, 2013, Subscribers: 26336, Members: Companies: 13353, Users: 34557 No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability by: Todd L Kolmodin, VP Quality; Indium Corporation of America No
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2271-underfill-voids
UNDERFILL VOIDS ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● D9650 ● D9650Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-fanout-for-bga_topic1888.xml
PCB Libraries Forum : Via Fanout For BGA PCB Libraries Forum : Via Fanout For BGA This is an XML content feed of; PCB Libraries Forum : Questions & Answers
