Industry Directory: underside (2)

Quik-tool, LLC

Industry Directory | Manufacturer

Quik-Tool designs and manufactures innovative automatic board supports for printers, placement sytems, etc.

Shenzhen Huancheng Automation Equipment Co., Ltd

Industry Directory | Manufacturer

Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.

New SMT Equipment: underside (23)

SRT Component Printing Metal Stencils

SRT Component Printing Metal Stencils

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printing

BEST Inc.

APR Component Printing Metal Stencil

APR Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

Electronics Forum: underside (159)

BGA underside cleaning

Electronics Forum | Thu May 07 08:31:13 EDT 1998 | Alan Pestell

We are about to use BGAs on our equipment. We clean all products prior to confomally coating them - to keep moisture off the IC legs. Will this be a problem with BGAs. Will we need to get the coating underneath the BGA or will the pitch on the balls

Re: BGA underside cleaning

Electronics Forum | Thu May 07 15:56:43 EDT 1998 | Terry Burnette

80ppm). The CTE of your board and solder joints will typically be 18-22ppm. We have seen cases were the coating fills the gap between the component and the board, then during temperature cycling the coating expands to the point of breaking the solder

Used SMT Equipment: underside (26)

Ekra Serio 4000 Vision Alignment System

Ekra Serio 4000 Vision Alignment System

Used SMT Equipment | AOI / Automated Optical Inspection

Details: • Ekra Vision Alignment System • Print Format 610 x 510mm • 2 1/2D Inspection • Underside Stencil Cleaner • Closed loop Print Head • Voltage 230 Condition:  Complete and Operational.  Location & Shipping:  USA / FOB Origin Availabil

Lewis & Clark

Manncorp 5500

Manncorp 5500

Used SMT Equipment | Screen Printers

Manncorp 5500 Dual Squeegee SMD Stencil Printer   Date of Manufacture:  2018   Details:   Dual Squeegee Manual SMD Stencil Printer Stencil Frame Size: 12' x 12 to 24" x 24" Max PCB Size: 14" x 17" X and Y Axes Range:  ± 13mm (±0.5") R Axis Range: ±5.

Lewis & Clark

Industry News: underside (66)

Spacers Provides PCB Hinges

Industry News | 2003-04-22 08:01:54.0

Two new additions to Heyco's range of PCB accessories are the SHCBS and SRF series of nylon circuit board spacers which, when used as a pair, provide a secure hinging mechanism for a mounted PCB.

SMTnet

COT Introduces New ezLOAD flex Adjustable Height Board Support System

Industry News | 2012-04-21 08:45:42.0

Count On Tools Inc. (COT), a leading provider of precision components and SMT spare parts, introduces the new ezLOAD flex PCB Support System

Count On Tools, Inc.

Technical Library: underside (5)

An Investigation Into The Durability Of Stencil Coating Technologies

Technical Library | 2019-03-13 15:19:55.0

It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide, there is also a cost. As PWB assemblers work to justify the return on investment, one key question continues to arise. What is the durability or life of these coatings and what can be done in the print process to maximize the life of the coatings?This paper addresses durability of the coatings in relation to the number of print cycles and underside wipe cycles applied as well as materials used on the underside wipe process. Different parameters will be applied and data will be collected. The results of this study will be summarized to help those using or considering the use of these nano coatings to improve their print process and suggestions will be given to maximize the life of the coatings.

FCT ASSEMBLY, INC.

Can Nano-Coatings Really Improve Stencil Performance?

Technical Library | 2017-10-26 01:18:49.0

Nano-coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include: Reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield. With several nano technologies already on the market and more likely to be introduced, how can the performance be quantified? How robust are these coatings? How can an assembler approach the ROI of these coatings? What hidden benefits or negative impacts should be considered? This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings.

FCT ASSEMBLY, INC.

Videos: underside (16)

MPM MOMENTUM+ PRINTER / M202388

Videos

Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema

Qinyi Electronics Co.,Ltd

MPM MOMENTUM+ PRINTER/M202395

Videos

Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema

Qinyi Electronics Co.,Ltd

Events Calendar: underside (2)

SMTA Dallas Chapter - Understanding Selective Solder Technology

Events Calendar | Fri Jan 11 00:00:00 EST 2019 - Fri Jan 11 00:00:00 EST 2019 | Richardson, Texas USA

SMTA Dallas Chapter - Understanding Selective Solder Technology

Surface Mount Technology Association (SMTA)

Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization

Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,

Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization

Surface Mount Technology Association (SMTA)

Express Newsletter: underside (9)

Partner Websites: underside (43)

2010 EKRA X4 Screen Printer - Lewis and Clark

Lewis & Clark | https://www.lewis-clark.com/product/2010-ekra-x4-screen-printer/

Screen Printer Home Screen Printer 2010 EKRA X4 Screen Printer 2010 EKRA X4 Screen Printer Call 603-594-4229 For Price Make:  EKRA Model:  X4 Vintage:  2010 Details: Windows XP Operating System APG Guidance System Magnetic Support Pins Wet/Vacuum Underside Stencil Cleaners 230v -1 Phase

Lewis & Clark

PVA DeltaBond-OTHER EQP-Suzhou Feierte electronic co.,ltd-welcome to KD Electronic

KD Electronics Ltd. | http://www.kundasmt.com/?OTHER-EQP/5972.html

: Patented Underside Dot Technology Fluid-Flow Vision System™ Cure in Place Technology (UV only) Exclusive PVA Portal Programming Interface 上一篇: HOTFLOW 3/20 下一篇

KD Electronics Ltd.


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