Vibration monitoring instrumentation: portable vibration meters and analyzers, protection systems for fans and pumps, high-end online systems for auxiliary machinery (pomps, fans, motors, bearings, gears) To learn more please visit our website
Flexible, Scalable Solutions For Maximum Versatility. Advantis® sets a higher standard for midrange assembly solutions, offering unmatched performance and flexibility at a low entry price. Advantis delivers scalable capacity, easy-to-use operation,
Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Electronics Forum | Mon Mar 05 10:43:29 EST 2007 | MGC
Universal Instruments provides certified on-site training. You may contact your local UIC Sales or Service team or one of these numbers: http://www3.uic.com/wcms/WCMS2.nsf/index/Contact_Us_94.html
Used SMT Equipment | Pick and Place/Feeders
we have available some 4796L and 4796R machines in top conditon no miossing parts years 2000 come with over 50 feeders. please contact for more information thanks Robi
Used SMT Equipment | Conveyors
Make: Universal Model: 5326i Description: Conveyor Quantity: 9 Dropbox Link to additional photos: https://www.dropbox.com/sh/nqv1ir96ajyzsyi/AADVxqoxweToNOACXPnyg5Fta?dl=0 Make: Universal Model: 5362T Descrip
Industry News | 2003-03-04 08:31:59.0
Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market
Industry News | 2014-02-18 17:01:34.0
The SMTA is pleased to announce the program for the 2014 International Conference on Soldering and Reliability being held May 13-15 in Toronto, Ontario, Canada.
Parts & Supplies | Pick and Place/Feeders
Universal GSM Nozzles available for flexhead and flexjet Universal GSM FlexHead Nozzles Part Number Product Description 45466933 120F Molded Nozzle 45466916 125F Compliant Tip Nozzle 45466921 160F Compliant Tip Nozzle 45466931 234F Molded
Parts & Supplies | Assembly Accessories
40000685 Universal Motor X-Axis for SMT Pick and Place Machine
Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
Make: Universal Model: Genesis GI-07S – 4992C (With PTF) Vintage: 2012 SW: UPS+ 8.3.0.10. Details: • Linear X/Y • 7 spindle head • Nozzle changer • Magellan 2.3 camera • PTF mounted on rear Visit www.lewis-clark.c
SUPPORT & NEWS Sales and Technical Service Packing and Shipping Latest News Download Catalogue CONTACT US Symor Instrument Equipment Co.,Ltd Email:Sales@climatechambers.com Tel: +86-551-63853683,68663633,663853681 Fax:+86-551-68663630 A
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
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