JUKI 8X2 feeder part upper cover E1203706CA0 Sales: Becky Su MP:86-15323874439 Email: becky@hysmt.cn beckysusmt@hotmail.com Skype: beckysmt Website: www.smt-cn.com
upper cover 05 asm (atf) e1201-706-aa0
Electronics Forum | Wed Mar 03 23:07:59 EST 2010 | davef
If your "engineer reviewed the reflow profile and said this was not related to reflow conditions," then what does he think it's related to? We think that a increased effort to improve the thermal recipe to solder this part is required, because: * S
Electronics Forum | Fri Sep 24 14:52:10 EDT 2021 | majdi4
Hello Rainey.. I think that hiden component by the upper shield couldn't be inspected..if the component isn't totally covered by the shield , on can only use the inspection option "missing" by selecting component corners to check only the presence..
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System Brand: Speedline Model: Aquastorm 200 (Torrid Zone) Serial #: 480409 Year: 2004 Type: In-line Cleaner Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray m
Industry News | 2017-01-24 18:26:09.0
KIC is pleased to announce the appointment E-tronix as its representative in the Upper Midwest. E-tronix is an experienced manufacturers’ representative company that specializes in the electronics assembly, medical device manufacturing, semiconductor manufacturing and research and development industries. KIC has signed on E-tronix to cover the Upper Midwest territory, including Minnesota, Indiana, Illinois, Wisconsin, North Dakota, South Dakota and Iowa.
Industry News | 2011-06-07 16:55:44.0
Tonka Electronics will highlight various products and technologies at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 9, 2011 at the Sheraton Bloomington Hotel in Bloomington, MN.
Technical Library | 2021-12-29 19:37:20.0
The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests.
E1330717000 ZST SHUTTER GUIDE E1330721000 COVER FUR E133072100A COVER FUR (ST) E133072100B COVER FUR (ZN) E1330725000 COVER FUR E13307250B0 COVER (UPPER) SUB ASM. E1330725FA0 COVER (UPPER) ASM.(STB) E1331706000 FEEDING CAM PLATE E1331
E1330717000 ZST SHUTTER GUIDE E1330721000 COVER FUR E133072100A COVER FUR (ST) E133072100B COVER FUR (ZN) E1330725000 COVER FUR E13307250B0 COVER (UPPER) SUB ASM. E1330725FA0 COVER (UPPER) ASM.(STB) E1331706000 FEEDING CAM PLATE E1331
Events Calendar | Thu Jan 17 00:00:00 EST 2019 - Thu Jan 17 00:00:00 EST 2019 | St Paul, Minnesota USA
SMTA Upper Midwest Chapter - Designing Flexible Circuits with Successful Assembly in Mind
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)