Electronics Forum | Mon May 31 11:04:06 EDT 2010 | aj
Hi Manuel, Do you not have a fine pitch placer?if not may be you need to slow down the placement speed on the QFN - I would imagine you would get a lot of fails trying to use the vision to pick up the component lands. We place thousands of QFNs and
Electronics Forum | Thu Jun 10 16:51:01 EDT 2010 | daxman
Hi Manuel, We've been placing QFN's with our CP6's for a long time now. We use vision type 10 just like you describe. I wouldn't bother with front lighting & trying to pick up the leads. Inspecting the leads doesn't provide better accuracy. I would
Industry News | 2012-07-06 19:44:05.0
Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.
Industry News | 2012-07-06 19:44:24.0
Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
SMTnet Express, June 11, 2015, Subscribers: 22,861, Members: Companies: 14,392 , Users: 38,338 Solder Paste Stencil Design for Optimal QFN Yield and Reliability B. Gumpert; Lockheed Martin Corporation The use of bottom terminated components (BTC
KingFei SMT Tech | http://www.smtspare-parts.com/quality-11936650-220v-50-60hz-solder-paste-inspection-table-top-3d-spi-7500-vision-ce
scan type which is able to measure and analyze the small-sized object image and the print image of Solder Paste as well. In particular, it is a on-board type one suitable for controlling the screen print process optimally by measuring and analyzing the solder cream coated after screen print in 3D and is also optimal of
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
– Low Temperature Co-Fired Ceramic (LTCC) Technology for High Temperature Electronics P. Vianco, J. Rejent, M. Grazier, A. Kilgo, B. McKenzie, A. Allen, E. Guerrero and W. Price Abstract 29-2 Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Arrangements Cong Zhao, Chaobo Shen, Zhou Hai
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