Pfeiffer Vacuum is the leading manufacturer for vacuum technology, vacuum pumps and vacuum solutions: From a single component to complex vacuum systems.
Industry Directory | Distributor / Manufacturer
Equip-Test with Global Headquarter in Budapest Metropolitan Area, Europe is a global player in manufacturing PCB test equipment.
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Test Equipment
Inline test system for incircuit and functional tests with Teradyne measuring equipment ENGMATEC presented for the first time a test handler with integrated Test Station Inline TSi from Teradyne. On request of the Boston company Teradyne, a test
Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Used SMT Equipment | General Purpose Test & Measurement
TERADYNE, Testing Machine, type Spectrum 8800 Series, SN: 8855-088, with inside 30 cards modules, included Pentium PC inside, software Windows NT, Service Pack 6, with keyboard and flat screen, n.1 vacuum pump, size approx. 2, 30 x 1, 80x1, 60 meters
Used SMT Equipment | Pick and Place/Feeders
Weight (KG) 3500 Video outgoing-inspection Provided Machinery Test Report Provided Core Components PLC, Engine, Bearing, Gearbox, Motor, Pressure vessel, Gear, Pump Place of Origin Japan Warranty 6 Months Condition Used Br
Industry News | 2021-12-09 09:26:46.0
Baja Bid is liquidating excess equipment via online auction. The bidding for this event is now open and the closing will begin today at 1:00 pm EST.
Industry News | 2011-03-24 11:31:33.0
Count On Tools introduces MYDATA Replacement Inline Filters and Filter Housing components. Count On Tools replacement inline filters have been field tested and are proven to increase vacuum and air performance in the equipment while lasting longer than OEM versions. The new inline filters are capable of capturing particles as small as 0.1 µm.
Parts & Supplies | SMT Equipment
CP40 vacuum valve if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP:
Parts & Supplies | Assembly Accessories
KHY-M4591-01 Vacuum test panel YAMAHA YG12 KHY-M4591-01 Category: Test plate Condition: new Model Year: 2016 Manufacturer: YAMAHA Description: "KHY-M652L-00 SENSOR,POS 1 YG12 KHM-M654B-01 SENSOR,FIBER 1 YS24 KHM-M654C-01 SENSOR,F
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
03064241-01 toothed belt / 296-5M-25 HTD toothing 03064243-01 toothed belt 10T5-740 endless 03064276-01 sensor pushbutton /WTB4-3P3162 3p. Cable 03064301-01 toothed belt / 10T5-280 03064481-01 BALL BEARING 6000-2Z 030652
03065247-01 Tape Cutter frequency controller 03065247S01 Tape Cutter frequency controller 03065248-01 FREECOM DVD writer and rewriter 03065897-01 Flashadapter 03066091S01 Shield compl. 03066188-01 cover sheet left cpl. 03066189-01 cover sheet r
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Sep 11 00:00:00 EDT 2018 - Thu Sep 13 00:00:00 EDT 2018 | Novi, Michigan USA
Battery Show
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/Wafer-Option-PBFT-PBT-3000M.pdf
Wafer Peel Back Test Wafer Peel Back Test Option Operating Guide Part No. PBT-3000M 07/19/07 ©2007 GPD 611 Hollingsworth Street, Grand Junction, CO 81505 USA tel: +1.970.245.0408 fax: +1.970.245.9674 email: request@gpd-global.com www.gpd
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
