RESAM is the American Representative for the Eric Drives, variable frequency motor controls and vector drives.
New Equipment | Test Equipment
The TE1000 vector impedance analyzer is a versatile, portable test instrument which enables the user to make highly accurate impedance measurements through VHF RF frequencies. The TE1000 has full vector measurement capability, and accurately resolv
New Equipment | Test Equipment
Teradyne’s Spectrum™ 8862 (TSSE) is a unique combinational in-circuit (ICT)/ functional test system that can lower overall costs and test times for manufacturers that prefer to combine functional and ICT test capabilities on a single system. Spectrum
Electronics Forum | Mon Dec 02 20:53:29 EST 2002 | davef
Gerber[R] Data (File). Used in directing a photoplotter during printed circuit board and stencil artwork fabrication. Gerber Scientific Instrument Company used to be the dominant producer of the photoplotters used for "shooting" film, back when mec
Electronics Forum | Thu Sep 20 15:02:36 EDT 2007 | pjc
You do not always need test points designed on the board. Any ICT supplier will consult with you on that and after looking at your designs. Teradyne offers new and refurb'd systems for ICT, analog only or w/ Vectorless testing to ensure ICs have a co
Used SMT Equipment | In-Circuit Testers
HP / Agilent 8753B Vector Network Analyzer, 300 kHz to 3 GHz with OPT 010 SKU9883 The HP Agilent 8753B Vector Network Analyzer operates from 300 kHz to 3 GHz The 8753B is ideally suited for component and network measurement. The 8753B has an integ
Used SMT Equipment | In-Circuit Testers
Agilent 89441A-AY8-AYA-AYH-UFG Vector Signal Analyzer The 89441A covers baseband through RF frequencies of dc to 2.65 GHz in scalar and vector analysis modes. The scalar RF instrument mode allows full-frequency coverage in spans to 2648 MHz.
Industry News | 2003-05-06 09:05:12.0
New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Parts & Supplies | Circuit Board Assembly Products
FUJI QP242E CPU BOARD（FH1019A) More SMT parts in stocks Fuji NXT H08M 10.0 Nozzle AA8MB06 Fuji NXT H08M 5.0G Nozzle AA8MG05 R19-050G-155-M Fuji NXT H08M 7.0G Nozzle AA8MH05 Fuji NXT H08M 1.8M Nozzle AA8MR04 R19-018M-155-M Fuji NXT H04S 1.0 No
Parts & Supplies | Circuit Board Assembly Products
KM5-M4200-022 System Unit Assy CPU Card with falsh disk for YAMAHA Surface Mount Technology Equipment KM5-M4230-000 Flash board Assy Yamaha KM5-M4211-002, KM5-M4200-030, KM5-M4230-000, KM5-M4220-002 Circuit Board Assembly T77848 SYSTEM UNIT ASS
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
SMT On-line 3D Solder Paste Inspection If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in
Quick Overview: Motor-driven MDS-710 With unique cutting method, the circuit board is cut by A, B, C, three groups of circular blades. The whole cutting process is divided into three stages which can reduce 80% stress compared with the traditional s
Career Center | Colorado Springs, Colorado USA | Engineering,Research and Development
At least 5 years of experience in DESIGN of RF circuits up to 6 Ghz. We want a real designer who's actually made RF designs work -- not someone who managed or worked on a project that had something to do with RF. Experience and knowledge of the in
Lewis & Clark | http://www.lewis-clark.com/product-tag/in-circuit-test/
! Teradyne Z1880 In-Circuit Tester Teradyne Z1880: – Front Slots: · 1 each 045-203-00 (Vector Processor) · 1 each 047-081-01 (DeltaScan II with Power Diconnect with Frame Scan
Imagineering, Inc. | https://www.pcbnet.com/blog/controlling-signal-integrity-in-high-speed-pcb-design/
Close Search Controlling Signal Integrity in High-Speed PCB Design By Behind the Work July 18, 2022 Blog , Industry News No Comments Simple printed circuit boards should function with little influence on other devices
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
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