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Industry Directory | Distributor / Manufacturer
Paramount Enterprises with a renowned brand PARENTNashik is an ISO 9001:2015 certified company, listed in major leading manufacturers, suppliers & exporters of resistance spot welding consumables,spares, weldparts in Nashik India
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Thu Jan 07 09:44:57 EST 2010 | cbart
What material is used to cap a via? Is it the standard LPI Process/Material?
Electronics Forum | Wed Jan 27 20:11:36 EST 2010 | plerma
What material is used to cap a via? Is it the > standard LPI Process/Material? we tent vias all the time, mostly to assist with assembly and the majority of the time outgassing is not a problem. What is the purpose in your case?
Used SMT Equipment | Coating and Encapsulation
NEW LISTING: PVA Sigma Benchtop Conformal Coating Machine * Facilities Power 120V-220V +/-10%, 50-60 Hz Air 80 psi, dry unlubricated Exhaust 300 cfm * Specifications X-Axis Stroke 330 mm (13.00”) Y-Axis Stroke 300 mm (11.81”) Z-Axis Stroke 100 mm
Used SMT Equipment | General Purpose Test & Measurement
The Agilent 1671G offers solid logic analyzer performance at an attractive price. Deep memory options let you capture more data and save you from having to set up complex triggers. The integrated oscilloscope option lets you view analog and digital s
Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Industry News | 2011-10-12 21:06:56.0
Count On Tools debuting the PB Computer Repair Toolkit from PB Swiss Tools. The new toolkit is designed for repair technicians and field service personnel to install, maintain and troubleshoot PCs, workstations and more.
Parts & Supplies | Pick and Place/Feeders
PANASONIC KSUN SMT REEL CAP MV/ MSH2 Part Name：REEL CAP MV/ MSH2 Part No：1016133013 More Panasonic feeder parts in stock 1089601092 Panasonic BM221 Feeder parts 104882000301 Panasonic Feeder snap spring KXF0DYAJA00 Panasonic CM402 12MM 16MM F
Parts & Supplies | Assembly Accessories
YAMAHA KHY-M7155-00 FILTER CAP YG12 More Yamaha parts in stock YAMAHA FEEDER PARTS CL84/82 K87-M111H-20X BACK STOPPER K87-M111B-00X BACK STOPPER AXIS KW1-M111A-00X SPRING K87-M111G-10X PUSH PIN K87-M111C-00X PLANE WASHER K87-M111P-00X SCREW,
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support
SMT MACHINE OPERATION, FORKLIFT CERTIFY, SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.
Career Center | , Texas | Human Resources,Maintenance,Management,Technical Support
Over 17 years in the training and development industry.� I have a track record of successes in designing strategic programs that address organizational skill gaps and business initiatives. Being an expert in Instructional Systems Design (ISD) I have
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/mems
. The MEMS components typically consist of MEMS, ASIC, substrate, wire bonds, and capping/molding. MEMS assembly has unique challenges because of their unique characteristics such as MEMS accessibility to environment and protection from environment
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_600-CIT.pdf
*In order for IPC Certification to be issued, completion of these two on-line programs must be completed outside of class via IPC's website
