Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Industry Directory | Manufacturer
Praxis Automation Technology, founded in 1965, with its main office in The Netherlands, began with manufacturing and supplying alarm and monitoring systems for sea going vessels.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Used SMT Equipment | Soldering - Reflow
For sale via unreserved, online auction ending August 25th from 10amBankruptcy auction of Ampere Inc. in La Pocatiere, Quebec, specializing in design and prototyping in the SMT field. Link to Auction: https://www.bidspotter.com/en-us/auction-catalogu
Used SMT Equipment | Pick and Place/Feeders
Description Make: Juki Model: KE-3010AL Year: 2016 Type: Placement Machin
Industry News | 2011-02-17 15:04:54.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.
Industry News | 2011-06-13 17:25:04.0
GPD Global will demonstrate its award-winning Positive Cavity Displacement (PCD) Dispensing in Booth #6186 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Sep 11 18:30:00 UTC 2023 - Mon Sep 11 18:30:00 UTC 2023 | ,
SMTA Workforce Dev. Webinar: Effectiveness of Strain Gage Methodology for Durable Board Design
Events Calendar | Tue Mar 12 18:30:00 UTC 2024 - Tue Mar 12 18:30:00 UTC 2024 | ,
SMTA Technical Webinar: Translating the Technology, a "Cross-Over" Event - High Reliability
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Data comminications and/or Telecommunication network design experience. Prior or post sales support. Network management experience (SNMP,NP, Openview, Cabletron Spectrum, etc) Experience designing international networks and de
Career Center | , | Engineering
we are looking for a mechanical engineer with the following qualifications: * BSME * US Citizenship * Pro-Engineer / Pro-Mechanica experience * Military electronics packaging background * Thermal and Structural Analysis (Shock, Vibe) analys
Career Center | , Abu Dhabi | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | Columbia, Missouri USA | Engineering,Management,Production,Research and Development
I have a wide range of experience, from working for a defense contractor to one of the world’s largest manufacturers, with more recent experience in a start-up technology company. I have a Bachelor of Science Degree in Electrical Engineering from P
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series
VIA High Volume Series | Nordson MARCH MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications
ORION Industries | http://orionindustries.com/emi-tapes.php
3M EMI Shielding Tapes Design ISO 9001:2015 Registered AS 9100 Registered UL Recognized SAM Registered ROHS Compliance 3M EMI Shielding Tapes Design Guides Designing products for steel rule die cutting An Overview of UL 94 Flame Testing 3M
