Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Thu Oct 31 11:08:12 EST 2002 | soupatech
Being very new to SMT I won't assume I know what the problem is but.... I had lots of air pockets in solder joints, 95% of the boards. Everyone I spoke to thought it was a problem with my process but when one board was sent to our supplier they admi
Rugged Material Feeding Unit for Highly Abrasive Dispensing Media With High Viscosity. Loading of Material From 20-Litre Drums With the Patented Scheugenpflug Barrel Follower Plate. The barrel (hobbock, pail) is positioned on the ergonomic hobbock d
