New Equipment | Assembly Services
SMT Xtra provides a full range of original or high quality replacement Spare Parts, Nozzles and Consumables for... SMT Placement Machines. SMT Screen Printers. SMT Dispensers. All of our Spare Parts, Nozzles and Consumables are qualit
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
Electronics Forum | Fri Jul 30 14:16:11 EDT 2004 | C.W
For VIA In PAD design, what's the difference between a thru vias and a blind via? thanks' chester
Electronics Forum | Fri Jul 30 14:21:36 EDT 2004 | C.W
what's the difference between a thru vias and a blind via?
Used SMT Equipment | General Purpose Equipment
Samsung Auto Pick and Place Machine 7500 pph,Lead Screw Refurbished w/ 15 8mm Feeders 2 Heads, InLine A fast (7,500 cph) machine with a long history of reliability that’s ideal for assemblers on a small budget who require high throughput. Fast and
Used SMT Equipment | Conveyors
2015 ASYS Insignum 1000 Scan Conveyor. FOB: Origin MN USA Contact: AssuredTechnicalServiceLLC@Gmail.com From the OEM: Scan module for the traceability process The INSIGNUM 1000 scan module is used to transfer data in a production line and thus supp
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Industry News | 2003-03-25 08:31:07.0
On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.
Technical Library | 2023-08-16 18:09:06.0
One of our customers involved with Electronics and Aerostructures requested a test to dispense Techspray Wondermask 2204 solder mask. The dispensing locations include large and small screw holes, single through-hole vias, and connector locations consisting of multiple through-hole vias. The process needed to run quickly and reliably.
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
Panasonic CM602 Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place m
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Tue Sep 17 00:00:00 EDT 2024 - Tue Sep 17 00:00:00 EDT 2024 | ,
Europe Chapter Webinar: Risk Assessment of Metallic and Non-Metallic Particles and Fibers
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Chino, California USA | Technical Support
The role of the Field Service/applications engineer is to provide professional service and support for Scienscope customers by performing field service installation, startup, repairs and maintenance of x-ray equipment. Typical duties will include b
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-pcb-advantages-and-applications/
(High Density Interconnect) technology is increasingly becoming the solution for smaller, more durable, and more efficient PCBs. HDI technology allows for lighter, smaller products that do more faster than ever before by leveraging blind and buried vias that can be staggered, stacked, and integrated with microvias
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/wafer-inspection-and-metrology
inline and lab based X-ray inspection and metrology solutions for assessing and monitoring wafer level quality. Check shape, fill level and voiding in TSV through silicon vias