New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Electronics Forum | Thu May 03 14:35:13 EDT 2018 | jimpat
Also, are there any other industry practices for void reduction? I read that Nitrogen helps.
Electronics Forum | Mon May 06 11:45:32 EDT 2019 | slthomas
There are quite a few papers out there on the subject. Just enter "SMT void reduction" into google or other search engine and take your pick. That said, slow ramp rates and paste volume reduction are a good place to start. Although I haven't tried i
Industry News | 2003-03-06 08:29:50.0
Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably
Industry News | 2018-12-11 19:24:48.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on January 10th from 5:00 PM to 7:30 PM at ZESTRON, Manassas, VA. Fred Dimock, BTU International, will be presenting “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data.”
Technical Library | 2023-01-17 17:25:14.0
BTC Void Reduction For Yield and Performance Enhancement
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
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TR7500 SIII CI brings easy Conformal Coating Inspection that combines a multi-camera optical design with specialized multi-phase lighting to inspect UV-active Conformal Coatings. Included angle view cameras ensure the TR7500 SIII CI identifies even t
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
40731 | https://www.smta.org/icehet/ICEHET-2020-Program.pdf
Surface Mount Technology Association (SMTA)
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-to-showcase-selective-soldering-platform-at-aci-technologies-open-house-september-25
. Equipment from dozens of companies will be demonstrated, along with presentations on automated optical inspection, void reduction, and failure analysis techniques
