Electronics Forum | Tue Jan 21 16:28:02 EST 2003 | tony_sauve
Sorry I didn't close this one off last year... We had some failure analysis done on these PCB's ( 3D x-ray,microsectioning,SEM) and the results definitively proved that there was some contamination @ the base of the uvia's that had the voiding. It ap
Electronics Forum | Sat Nov 24 22:15:16 EST 2001 | Glenn Robertson
Tony, I'm not sure if even baking will stop the voids if you have gaps in the plating. It probably doesn't take much moisture or even trapped air. I'm not speaking from a lot of direct experience here, so please run the tests and let us know wh
Industry News | 2012-02-13 23:35:23.0
MIRTEC Co. LTD, “The Global Leader in Inspection Technology,” reports continued growth in sales revenue for its North American Sales and Service Division for 2011. “We are extremely pleased to announce that sales revenue for our North American Division grew by over 21 percent in 2011,” stated Chanwha Pak, CEO.
Industry News | 2011-02-02 11:49:40.0
MIRTEC Co, LTD "The Global Leader in Inspection Technology"; reports strong growth in sales revenue for its North American Sales and Service Division. "We are very pleased to announce that sales revenue for this division grew by more than 62% in fiscal 2010," stated Chanwha Pak, CEO.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2012-12-06 17:36:37.0
Inspection of integrated power electronics equals sophisticated test task. X-ray inspection based on 2D / 2.5D principles not utilizable. Full 3D inspection with adapted image capturing and reconstruction is necessary for test task.... First published in the 2012 IPC APEX EXPO technical conference proceedings.
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