Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Electronics Forum | Mon Sep 11 00:31:13 EDT 2000 | rcsantos
Is there somebody who knows if there is a machine already available in market that can transfer die from wafer to waffle tray. This machine should a stand alone type or can be integrated to some P&P machine. What I'm trying to say is just like the on
Electronics Forum | Mon Sep 11 20:41:09 EDT 2000 | Dave F
Try: * Semiconductor Equipment 5154 Goldman Ave Moorpark CA 93021 805.529.2293 fax 2193 * Palomar ?? (Hughes Aircraft, Technology Products) 2051 Palomar Airport Rd., Carlsbad, CA 92009 619.931.3622 fax5191 Jeff King appl x3629 * Kulicke&Soffa, 201 B
Used SMT Equipment | SPI / Solder Paste Inspection
This equipment has been barely used and is in "Like New" condition.
Used SMT Equipment | Pick and Place/Feeders
YAMAHA i-PULSE M7-3L SMT machine Placement speed:65,000 points per hour Long substrate size: : L1290 x W410mm Component processing range :01005 to 23mm sq IC Dimension of equipment :L1,990 x
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Parts & Supplies | SMT Equipment
YAHAMA SMT YG12F , YS12F the image processing board. KHL-M441H-23X VISION BOARD ASSY KHL-M441H-23 VISION BOARD ASSYKHL-M441H-231 VISION BOARD ASSY
Parts & Supplies | SMT Equipment
YAHAMA SMT YG12F , YS12F the image processing board. KHL-M441H-23X VISION BOARD ASSY KHL-M441H-23 VISION BOARD ASSYKHL-M441H-231 VISION BOARD ASSY Pls kindly to contact with us at any time, if need more info about the products, thanks ! Email:
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2023-01-17 18:00:39.0
EQUIPMENT SUPPLIERS HAVE BECOME A RESOURCE FOR PROCESS CONTROL EXPERTISE, EVEN IN THE REFLOW OPERATION.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Nano-copper sintering in formic acid vapor.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Career Center | All over the world, Alabama USA | Engineering
2023 is the year for I.C.T's global localization strategy, and we are seeking talented individuals worldwide for the following positions. I.C.T adheres to the principles of "Simple, Open, Undertake, Coordination and Share" to build a pl
Career Center | South Plainfield, New Jersey USA | Sales/Marketing,Technical Support
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Over 20 Years Experience with SMT Processes at Large and Medium Sized Companies like Hitachi, Nokia, Siemens, and Variosystems Troubleshooting SMT Process Deficiencies and Recommending Short Term and Long Term Solutions. Developing Technical
Wafer-Level Packaged MEMS Switch With TSV Wafer-Level Packaged MEMS Switch With TSV by: Nicolas Lietaer, Thor Bakke, Anand Summanwar; SINTEF , Per Dalsjø, Jakob Gakkestad; Norwegian Defence Research Establishment (FFI), Frank Niklaus; KTH - Royal
Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University
GPD Global | https://www.gpd-global.com/wafer-edgeSeal.php
Wafer Edge Seal Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asm_MS899.html
ASM MS899 Wafer Mapping Die Sorter MS899-DL ASM MS899-DL Wafer Mapping Die Sorter Machine is in good condition! Serial Number: MS899DL-01817-0402 Model Number
