The W. M. Hague Company distributes interconnect test systems for bare board test and semiconductor substrate test. In addition the W. M. Hague Co. distributes conformal coating systems (both dip and spray), SIR test systems and Warpage testers.
Industry Directory | Manufacturer
Pillarhouse is a leading supplier of selective soldering systems for single-point and multi-point soldering configured for manual loading, in-line or as multiple unit in-line systems offering topside and in-line preheat.
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
The DispenseJet DJ-9500 supports a long list of jettable fluids for a wide range of applications. Incorporating over 15 years of jetting experience, the DJ-9500 jet provides even more capability than its DJ-9000 predecessor. Nordson ASYMTEK's jettin
Electronics Forum | Mon Aug 18 09:28:04 EDT 2008 | eyalg
The following standard is used to determine warpage: "High Temperature Package Warpage Measurement Methodology" JESD22B112
Electronics Forum | Mon Mar 03 10:31:57 EST 2003 | Tim Nicholson
Is there any standards for board warpage for surface mount boards?
Used SMT Equipment | Screen Printers
2.0 Cmk @ ± 12.5 μm (± 6 sigma) System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma) Optimum core cycle time 8 seconds Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) Operating System Windows 7 Embe
Used SMT Equipment | Preheaters
PCB flatness Inspection Machine PCB, warpage bending defect detection Inspection Range : 0 ~2000um
Industry News | 2011-08-17 12:59:10.0
The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Parts & Supplies | Soldering Equipment/Fluxes
3D Solder Paste Inspection Machine Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Ea
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Mayaguez, Puerto Rico | Engineering,Production
Detail oriented and goes to great lengths to insure that the products are meeting and exceeding customer expectations. Place procedures and training in place to provide former company with techniques for ISO 9001:2008 and QS 9000. Assist design engi
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
SMTnet Express, October 3, 2019, Subscribers: 32,260, Companies: 10,890, Users: 25,178 Effects of Temperature Uniformity on Package Warpage Credits: Akrometrix Knowing how package warpage changes over temperature is a critical variable in order