Electronics Forum: warpage cause (88)

Re: PCB warpage

Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell

With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r

Re: PCB warpage

Electronics Forum | Thu Oct 14 20:42:07 EDT 1999 | Jeff Ferry

Grace, As deifned in IPC 7721 Procedure 3.2 Bow and Twist Repair "Bow and twist after soldering shall not exceed 1.5% for through hole PC boards and .75% for surface mount PC boards. The bow and twist shall not be sufficient to cause difficulties d

Used SMT Equipment: warpage cause (1)

PARMI PARMI   SPI SPIHS60 MACHINE

PARMI PARMI SPI SPIHS60 MACHINE

Used SMT Equipment | SPI / Solder Paste Inspection

PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is

Qinyi Electronics Co.,Ltd

Industry News: warpage cause (18)

MIRTEC TO BRING 3D AOI AND SPI INSPECTION SYSTEMS TO PRODUCTRONICA

Industry News | 2013-10-08 15:37:23.0

MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems in Hall A2, Stand 578 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

MIRTEC Corp

SMTA International Tackles Head-in-Pillow Defects

Industry News | 2011-08-17 12:59:10.0

The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.

Surface Mount Technology Association (SMTA)

Parts & Supplies: warpage cause (1)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: warpage cause (1)

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Technical Library | 2021-01-13 21:34:29.0

Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...

Osaka University

Videos: warpage cause (2)

SMT On-line 3D Solder Paste Inspection ?

SMT On-line 3D Solder Paste Inspection ?

Videos

SMT On-line 3D Solder Paste Inspection ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in

Dongguan Intercontinental Technology Co., Ltd.

Saki introduces its new 3Di Automated Optical Inspection System

Saki introduces its new 3Di Automated Optical Inspection System

Videos

The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i

SAKI America

Training Courses: warpage cause (1)

Reflow Soldering 101 Training Course

Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

Surface Mount Technology Association (SMTA)

Career Center - Resumes: warpage cause (1)

Electronic Process Engineer

Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support

- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.

Express Newsletter: warpage cause (237)

Partner Websites: warpage cause (12)


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