Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer / Manufacturer's Representative
Hiflo Solders Private Ltd (HSPL) , was established in the early nineties and has grown into a business enterprise in manufacturing and marketing of Solders, Fluxes, Cleaners, Anodes, Soldering Accessories for the domestic & inte
New Equipment | Rework & Repair Equipment
The Zhuomao ZM-R7850A BGA Rework Station is a top of the line Nitrogen Capable Rework System. Great to help increase yield with Lead Free Solders and a no clean process. Place SMD components from .8mm to 80mm with the high resolution motorized vis
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
Electronics Forum | Fri Sep 11 06:35:19 EDT 1998 | KME
How can solve the small solder ball after w/s. (oxygen level is 40000~5000ppm, no-clean flux & Tamura N2 w/s machine).
Electronics Forum | Wed Nov 14 12:11:04 EST 2001 | eabbott
We are experiencing many solder balls after wavesolder. Two different board suppliers of the same board are involved. My initial reaction was that it was the process but in researching information in this forum I am beginning to wonder. How can on
Used SMT Equipment | SPI / Solder Paste Inspection
Make: Koh Young Model: 8030-3L Vintage: 2011 Details: • Windows XP Operating System • 3D • 4M Pixel High Speed Camera • Automatic Conveyor Width Adjustment • Front/Rear Fixed Conveyor • SPC Plu
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | Repair/Rework
PG-N4500 Main Features： 1、Adopt liner slide which makes X、Y、Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability. 2、High definition touch screen (Taiwan) , PCL control, can save m
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Parts & Supplies | Pick and Place/Feeders
Supply&repair below cyberoptics spare parts at a lower price: Camera: 8008629 8008630 8008632 8008633 8008634 8012979 8012980 8012982 8012983 Card 6604030 6604045 6604067 6604071 6604083 6604099 8000289 8005171 8007156 8010494 KG7-M4547
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Flowery Branch, Georgia USA | Production
Ideal candidate must already be located in Atlanta metro area and have significant experience programming and operating Siemens F-15 and S-20 SMT, Reflow (Seho experience a plus) and Wave-Solder (Seho expererience a plus). Lead and RoHS experience re
Career Center | Danville, Illinois USA | Production
http://jobs-watchfiresigns.icims.com/watchfiresigns_jobs/jobs/candidate/job.jsp?jobid=1005&mode=view Overview: Watchfire Signs is a dynamic, exciting place to work. Our process engineers utilize their required Bachelors of Engineering and required
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Hands on experience in PLC based machine, DEK Printer Machine, Camlot Glue dot machine, Fuji NXT, SPI machine, reflow: Vitronics XPM2/3, Expertise in SMT Profiling Qualification & NPI Build, Soldering defects, Analysis & rework. Line modifi
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
Featured Article Return to Front Page REFLOW SOLDERING
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1066-voids-in-solder
VOIDS IN SOLDER ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● Gen6 ● D9600 ● D9600Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
| https://www.smtfactory.com/LED-Bulb-Production-Line-in-Egypt-and-Market-Analysis-id3803161.html
LED Bulb Production Line in Egypt and Market Analysis - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
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