GDK Single Lane 3D Solder Paste Inspection Machine,Spi Machine Production Overview: SLE/SLE-D is used to detect and monitor the quanlity of solder paster printing. With the increasing precision of electronic products, chip components are becoming s
Industry News | 2018-10-18 10:18:58.0
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
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Imagineering, Inc. | https://www.pcbnet.com/blog/causes-of-pcb-warping-how-to-prevent-it/
. Other causes of warping include: Heat Sinks and PCB Warping – Warping primarily occurs during preheating, and can also occur during the soldering process which applies localized heat to specific areas of the board. But warping
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